Micro-LED Pixel Cavity Structure for Higher Light Extraction
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Solution Overview
Problem
Existing display devices using light-emitting diodes face challenges in size, luminous efficiency, transfer process complexity, transfer efficiency, cost, and color performance.
Innovation Solution
A display device design incorporating a circuit substrate, pixel definition layer, light-emitting chip with a reflective layer and filling layer, and an underfill layer, which includes a vertical light-emitting diode structure and a color conversion layer to improve luminous efficiency and reduce transfer complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional light-emitting diode structure is used, then the device is simpler to manufacture, but the size is larger and luminous efficiency is lower
Solution Approach 1:
The light-emitting diode is embedded within a cavity formed in the pixel definition layer, creating a nested structure where the LED sits inside a recessed area. This nesting approach reduces the overall footprint while maintaining manufacturing simplicity by utilizing the cavity structure for both mechanical support and optical confinement.
Solution Approach 2:
The invention transitions from a planar LED structure to a three-dimensional configuration by creating a cavity in the pixel definition layer. The LED is positioned vertically within this cavity, utilizing the depth dimension to reduce lateral footprint while improving light extraction efficiency through the cavity walls.
2Area of moving object
If the light-emitting diode size is reduced, then the display resolution improves, but the transfer process becomes more complex and less efficient
Solution Approach 1:
The pixel definition layer is formed with cavities prepared in advance before the light-emitting diodes are transferred. This preliminary structuring allows for batch processing of multiple LEDs simultaneously, maintaining high transfer efficiency even as individual LED sizes decrease. The pre-formed cavities serve as ready-made receptacles that guide the transfer process.
3Manufacturing precision
If a reflective layer is added to the light-emitting chip, then luminous efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The reflective layer is integrated directly into the light-emitting chip structure during the chip fabrication process, merging the reflective function with the LED active layer. This integration approach avoids adding separate reflective components and reduces overall manufacturing complexity while achieving improved luminous efficiency through enhanced light extraction.
4Manufacturing precision
If the pixel definition layer includes a cavity, then the light extraction efficiency improves, but the manufacturing process becomes more complex
Solution Approach 1:
The pixel definition layer is segmented into multiple regions including the cavity area and surrounding structures. This segmentation allows the cavity to be formed using standard photolithography and etching processes that divide the layer into functional zones, making the manufacturing process manageable despite the added structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the size of the light-emitting diode, enhances luminous efficiency, simplifies the transfer process, and improves color performance while reducing costs.
Implementation Method 1
The reflective layer is disposed on a side surface of the filling layer
Data Source
AI summary
A display device includes a circuit substrate, a pixel definition layer, a light-emitting chip, and an underfill layer. The pixel definition layer is disposed on the circuit substrate and includes an aperture. The light-emitting chip is disposed in the aperture and electrically connected to the circuit substrate. The light-emitting chip includes a light-emitting diode, a filling layer, and a reflective layer. The filling layer surrounds the light-emitting diode. The reflective layer is disposed on a side surface of the filling layer. The underfill layer is disposed between the light-emitting chip and the pixel definition layer.