Micro-LED Pixel Circuit Stacking for Easier High-Resolution Assembly
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Solution Overview
Problem
The existing methods for manufacturing optoelectronic devices with light-emitting diodes (LEDs) face challenges such as complex alignment processes due to the small size of LEDs, increased manufacturing time with higher resolution, and difficulties in displaying high-resolution video streams, particularly for micro-sized LED screens like those used in TVs and smartphones.
Innovation Solution
The proposed solution involves an optoelectronic device design with a support having conductive layers and display pixel circuits where each display pixel circuit includes an electronic circuit and an optoelectronic circuit with LEDs, where the LEDs are connected to the circuit via a third face, allowing for simplified assembly and reduced precision requirements, enabling the use of intelligent pixels that eliminate the need for thin film transistors (TFTs) and facilitate active matrix control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pick and place method is used to manufacture optoelectronic devices with LEDs, then the device can be assembled from separate components, but the alignment processes become complex and manufacturing time increases
Solution Approach 1:
The patent merges the LED component with its support structure by integrating the LED directly onto the support substrate, eliminating the need for separate pick-and-place assembly operations. This integration reduces alignment complexity and manufacturing precision requirements while maintaining the ability to assemble from modular components.
2Measurement precision
If the resolution of the optoelectronic device is increased, then the image quality improves, but the number of LED transfers increases and manufacturing time increases
Solution Approach 1:
The patent segments the display into larger pixel modules or blocks that can be manufactured and tested independently before final assembly. This segmentation reduces the total number of individual LED transfer operations required while maintaining high overall resolution, as fewer but larger units need to be positioned on the support structure.
3Ease of operation
If individual LED components are assembled with driver circuits, then the device can be controlled, but the assembly complexity increases and data transmission capability is reduced
Solution Approach 1:
The patent merges the driver circuit functionality directly into the support structure or integrates it closely with the LED array, eliminating the need for separate wire connections between individual LEDs and driver circuits. This integration reduces assembly complexity while maintaining full control capability and enhancing data transmission efficiency through streamlined signal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity and cost of manufacturing optoelectronic devices on an industrial scale, enhances the ability to display high-resolution video streams, and increases the brightness and data handling capacity of large screens by integrating control electronics directly under the pixels.
Implementation Method 1
Each display sub-pixel may comprise a light source, in particular a light-emitting diode, for example based on semiconductor materials
Implementation Method 2
at least one optoelectronic circuit attached to the third face and comprising at least one light-emitting diode (LED)
Data Source
Figure 1~2
Figure 3~5
Figure 6~8B
AI summary
The invention concerns an optoelectronic device (10) comprising: a substrate (12); at least a first electrically conductive layer (18) covering the substrate; display pixel circuits (Pix) comprising first and second opposite faces (22, 23), attached to the first electrically conducting layer, each display pixel circuit comprising an electronic circuit (20) including the first face and a third face (24) opposite the first face, the first face being attached to the first electrically conductive layer, and at least one optoelectronic circuit (26) attached to the third face and comprising at least one light-emitting diode, at least one of the electrodes of the light-emitting diode being connected to the electronic circuit by the third face; at least one second electrically conductive layer (34) covering the display pixel circuits and electrically connected to the electronic circuits of the display pixel circuits on the side of the second face.