Micro-LED Display Electrode Layout for Self-Aligned Pixel Contacts

The patent segments the manufacturing process into distinct stages: forming insulation layers with openings, selectively forming electrodes in openings, and sequential annealing steps. This segmentation allows precise control over each step to minimize defects while maintaining ultra-small LED dimensions for high-resolution displays.

The patent performs preliminary actions by pre-forming insulation layers with precisely positioned openings before electrode formation, and conducting first annealing before second annealing. This preliminary structuring ensures proper alignment and reduces manufacturing defects in ultra-small LEDs, improving both resolution and reliability.

The patent employs self-alignment mechanisms where electrodes are formed within pre-defined insulation layer openings, allowing the structure to self-align during subsequent processing steps. This self-service approach maintains manufacturing efficiency while achieving high alignment precision for ultra-small LEDs without requiring complex external alignment equipment.

The patent replaces mechanical alignment systems with a field-based approach using annealing processes. The first and second annealing steps create ohmic contacts through thermal diffusion without mechanical contact, eliminating alignment errors introduced by mechanical positioning while maintaining high productivity in ultra-small LED manufacturing.

The patent merges the contact formation process with the annealing process by conducting first and second annealing steps that simultaneously achieve ohmic contacting and structural stabilization. This merging of functions improves contact quality while minimizing the number of separate process steps, reducing overall manufacturing complexity despite the advanced annealing techniques used.

The patent utilizes controlled parameter changes in the annealing process (temperature, time, atmosphere) to achieve ohmic contacts. By precisely adjusting annealing parameters rather than adding complex mechanical or chemical steps, the patent improves contact quality while keeping the manufacturing process relatively simple and scalable for ultra-small LED production.