Micro-LED Display Pixel Layout for Faster Panel Repair
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Solution Overview
Problem
The increasing resolution and size reduction of micro-LED display panels have made crystal grain transfer more difficult, necessitating a pixel structure that is easy to repair to enhance the repair yield and production efficiency.
Innovation Solution
The display panel design includes a substrate with display pixels featuring multiple pad sets, light-emitting devices, and connecting wires, where the connecting wires are strategically placed in cutting regions to facilitate efficient repair by reducing the number of cuts required, thereby shortening repair time and improving production yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the resolution of the display panel is increased and the size of pads is reduced, then the display quality is improved, but the difficulty of crystal grain transfer increases and repair becomes more difficult
Solution Approach 1:
The pad structure is segmented into first pads and second pads with different functions. The first pads are configured for bonding light-emitting devices while the second pads are configured for bonding repair wires, allowing independent access and repair operations without affecting the entire pad structure.
Solution Approach 2:
Repair wires are introduced as intermediary elements that connect to the second pads and extend to cutting regions. These wires serve as mediators between the micro-LED crystals and the external repair equipment, enabling repair operations on high-resolution panels without directly manipulating the tiny first pads.
2Manufacturing precision
If the number of crystal grain transfers is increased to achieve higher resolution, then the display quality is improved, but the repair time and complexity increase
Solution Approach 1:
The second pads and repair wire connection structures are prepared in advance during the manufacturing process, with cutting regions pre-defined. This preliminary preparation allows repair technicians to directly access and replace individual crystals without time-consuming setup or routing operations, significantly reducing repair time even as the number of crystals increases.
Solution Approach 2:
The repair wire arrangement utilizes spatial arrangement in cutting regions, positioning connecting portions of repair wires in specific zones that facilitate efficient access. This dimensional organization of repair pathways allows parallel processing and reduces the time required to service multiple crystals in high-resolution displays.
3Manufacturing precision
If the pads are made smaller to increase resolution, then the display quality is improved, but the number of cutting regions and repair complexity increase
Solution Approach 1:
Multiple functional elements are merged into an integrated pad structure: the first pads for crystal bonding, the second pads for repair wire bonding, and the cutting region definitions are all combined in a single structural design. This merging reduces the number of separate components and simplifies the overall repair process despite the high number of crystals.
Solution Approach 2:
The second pads serve multiple functions: they provide electrical connection points for repair wires, define cutting region boundaries, and enable access to underlying crystals. This multi-functionality reduces the need for separate dedicated repair structures for each crystal, thereby reducing overall system complexity.
Data Source
AI summary
A display panel includes a substrate and display pixels. The display pixels are disposed on the substrate, and each of the display pixels includes pad sets, light-emitting devices, a first connecting wire, a second connecting wire, and first cutting regions. Each pad set has a first pad and a second pad. The light-emitting devices are electrically bonded to at least part of the pad sets. The first connecting wire is electrically connected to the first pads of a plurality of first pad sets of the pad sets. The second connecting wire is electrically connected to the second pads of the pad sets. The first cutting regions are disposed on one side of each of the first pad sets. Two first connecting portions of the first connecting wire and the second connecting wire connecting each of the first pad sets are located in one of the first cutting regions.