Micro-LED Recess Structures for Low-Power Substrate Optical Links
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Solution Overview
Problem
Current micro-LED technologies face challenges in achieving efficient optical communication due to high costs, power consumption, and complexity in laser-based silicon photonics, particularly in short-range data communications, which are essential for growing data network demands in data centers and compute systems.
Innovation Solution
The development of micro-LED structures integrated into a transparent substrate with recess structures, utilizing doped portions and quantum well structures to communicate optical signals, enabling space-efficient and cost-effective optical communication paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If laser-based silicon photonics are used for optical communication, then communication distance can be extended, but power consumption increases and cooling requirements become more complex
Solution Approach 1:
The patent replaces laser-based optical sources with micro-LED structures that integrate directly with silicon photonics waveguides. This substitution eliminates the need for external laser modules and complex optical coupling mechanisms, reducing power consumption while maintaining communication capability. The micro-LEDs are electrically connected to driver circuits and optically coupled to waveguides through recess structures, creating a more energy-efficient system compared to traditional laser-based solutions.
2Adaptability or versatility
If laser modules and optical waveguides are combined with micro-ring macros, then optical communication functionality is achieved, but physical area increases significantly
Solution Approach 1:
The patent embeds micro-LED structures within recess structures formed in the substrate, which then couple to waveguides that are integrated within the same substrate plane. This nested arrangement places the light source, coupling mechanism, and waveguide transport path in a compact hierarchical configuration, dramatically reducing the footprint compared to discrete laser modules placed outside the chip.
Solution Approach 2:
The patent merges the micro-LED light source, the optical coupling structures, and the waveguide transport path into a single integrated substrate. This consolidation eliminates the need for separate laser modules and external optical components, achieving full optical communication functionality within a compact area suitable for data center and on-package applications.
3Object-generated harmful factors
If external laser modules are used to pump light into silicon photonics chips, then optical signal generation is achieved, but device complexity and cost increase
Solution Approach 1:
The patent extracts the optical signal generation function from external laser modules and relocates it directly onto the silicon photonics substrate through integrated micro-LED structures. This extraction eliminates the need for complex external laser pumping mechanisms, optical coupling aligners, and associated control systems, simplifying the overall device architecture while maintaining optical signal generation capability.
4Area of stationary object
If micro-LED structures are formed in recess structures of transparent substrate, then space efficiency and cost are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent forms recess structures in the transparent substrate before depositing the micro-LED structures. This preliminary action creates pre-defined cavities that guide the subsequent formation and placement of micro-LEDs, ensuring precise positioning and alignment. The recess structures act as templates that simplify the manufacturing process and reduce precision requirements compared to attempting to form micro-LEDs directly on a flat substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances energy efficiency and reduces costs by providing a compact and efficient means for optical signal transmission and reception, addressing the limitations of traditional laser-based systems and supporting the growing demands of data networks.
Implementation Method 1
a micro light emitting diode (uLED) structure disposed on the first surface, wherein the uLED structure extends in the recess structure, wherein the uLED structure is oriented to communicate an optical signal which is propagated through the transparent substrate structure
Data Source
AI summary
Techniques and mechanisms for a micro-LED (or “uLED”) device to facilitate communication of an optical signal which is propagated via a transparent substrate structure. In an embodiment, one or more recess structures are formed in a side of a transparent substrate structure, such as a glass core of a package substrate. A uLED structure extends partially through the transparent substrate structure in a first recess structure, and is oriented to transmit or receive an optical signal via the transparent substrate. In another embodiment, the uLED structure is coupled to integrated circuitry which provides functionality to operate the uLED structure, at different times, in either one of an optical signal receiver mode or an optical signal transmitter mode.