MicroLED Repair via Temporary Adhesive Transfer
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Solution Overview
Problem
The challenge in manufacturing direct view display devices using microLEDs is the high failure rate of microLED transfer to the backplane, resulting in imperfect devices, necessitating a method for repairing such devices by replacing defective microLEDs.
Innovation Solution
A method involving a repair source substrate with an array of microLEDs, temporary adhesive layers, and carrier substrates is used to selectively bond and transfer replacement microLEDs to vacancy locations on the backplane, ensuring functional pixel elements in the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If microLED transfer process is used to manufacture direct view display devices, then productivity is improved, but manufacturing precision deteriorates due to high failure rate of microLED transfer
Solution Approach 1:
The patent applies preliminary action by preparing a repair source substrate with replacement microLEDs in advance, before the actual repair process. This allows defective microLEDs to be replaced systematically without disrupting the main manufacturing flow, thus maintaining productivity while improving transfer precision through pre-prepared replacement elements.
Solution Approach 2:
The patent uses a temporary adhesive layer as an intermediary between the repair source substrate and the display device backplane. This intermediary enables controlled transfer of replacement microLEDs to specific vacancy locations, improving transfer accuracy while maintaining efficient manufacturing processes through standardized intermediate handling.
2Reliability
If all microLEDs are required to be functional, then reliability is improved, but device complexity increases due to need for repair processes
Solution Approach 1:
The patent segments the manufacturing process into distinct phases: initial microLED transfer, defect identification, and targeted repair. By separating the repair function into an independent module using a dedicated repair source substrate, the overall process complexity is managed while ensuring all microLEDs are functional for improved reliability.
Solution Approach 2:
The patent implements discarding and recovering by removing defective microLEDs from the display device and replacing them with functional ones from the repair source substrate. This approach maintains high reliability by ensuring all microLEDs are functional, while the standardized repair process minimizes added complexity through systematic replacement procedures.
3Manufacturing precision
If repair process is implemented to replace defective microLEDs, then manufacturing precision is improved, but loss of time increases due to additional processing steps
Solution Approach 1:
The patent merges the repair process with the existing manufacturing workflow by using similar temporary adhesive layers and transfer mechanisms already established in the main production line. This integration allows repair operations to be performed efficiently without requiring entirely separate equipment or procedures, thus improving placement accuracy while minimizing time loss.
Solution Approach 2:
The patent applies skipping by performing rapid adhesive removal and microLED transfer operations using established process parameters. By optimizing the adhesive removal step and using pre-positioned replacement microLEDs, the repair process completes quickly, improving placement accuracy without significant time penalty to overall manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively repairs imperfect direct view display devices by ensuring all microLEDs are functional, enhancing the yield and functionality of the display device by replacing defective microLEDs during the manufacturing process.
Implementation Method 1
providing a first carrier substrate with a temporary adhesive layer thereupon, forming a first assembly including the first carrier substrate and at least one first light emitting diode that is a subset of the array of first light emitting diodes, where the at least one first light emitting diode is attached to the first carrier substrate through a respective portion of the temporary adhesive layer
Implementation Method 2
providing a second carrier substrate with a temporary bonding layer thereupon, attaching the at least one first light emitting diode to the temporary bonding layer
Data Source
AI summary
A method of repairing a light emitting device assembly includes providing a repair source substrate with an array of first light emitting diodes, providing a first carrier substrate with a temporary adhesive layer thereupon, forming a first assembly including the first carrier substrate and at least one first light emitting diode that is a subset of the array of first light emitting diodes, where the at least one first light emitting diode is attached to the first carrier substrate through a respective portion of the temporary adhesive layer and detached from the repair source substrate, providing a second carrier substrate with a temporary bonding layer thereupon, attaching the at least one first light emitting diode to the temporary bonding layer, detaching the first carrier substrate from each portion of the temporary adhesive layer, removing each portion of the temporary adhesive layer from the at least one first light emitting diode, providing a light emitting device including at least one vacancy location and an array of light emitting diodes bonded to a backplane, and bonding the at least one first light emitting diode to the respective at least one vacancy location within the light emitting device.