Micro-LED Repair Bonding With Elastic Conductive Pads
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Solution Overview
Problem
The instability of electrical connections between new micro-LEDs and display panels due to temperature-induced expansion or contraction of connection parts leads to failure in light emission in display modules, especially when replacing defective micro-LEDs.
Innovation Solution
A method involving the formation of an elastic conductive pad on the display panel, where a new micro-LED is elastically connected using a conductive layer and an adhesive layer, followed by a protective layer to maintain the connection, ensuring physical and electrical stability despite temperature changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a new micro-LED is mounted on the display panel using conventional methods, then the replacement process is simple, but the electrical connection becomes unstable due to thermal expansion and contraction
Solution Approach 1:
The patent changes the physical state and mechanical properties of the connection structure by introducing an elastic layer that can deform elastically. This allows the connection to adapt to thermal expansion and contraction without losing electrical contact, resolving the contradiction between simple replacement and stable connection.
Solution Approach 2:
The patent uses a composite structure consisting of multiple layers including an elastic layer, conductive layer, and protective layer. This composite material approach combines the advantages of each layer to achieve both ease of manufacturing and reliable electrical connection stability under temperature variations.
2Manufacturing precision
If the electrode pads of micro-LEDs are made with fine size to achieve high resolution, then the display quality improves, but the mounting position becomes sensitive to temperature changes causing connection failure
Solution Approach 1:
The patent introduces an elastic layer that can change its deformation state in response to temperature changes. This parameter change allows the fine micro-LED electrode pads to maintain stable electrical connection despite thermal expansion and contraction of the display panel, resolving the contradiction between high resolution and connection reliability.
3Reliability
If a rigid connection structure is used to ensure stable electrical connection, then connection reliability improves, but the structure cannot accommodate thermal expansion and contraction
Solution Approach 1:
The patent replaces the rigid connection structure with a dynamic elastic layer that can deform and adapt to thermal changes. This dynamic structure maintains electrical connection stability while accommodating the thermal expansion and contraction of the display panel, resolving the contradiction between connection reliability and thermal adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable and stable electrical connections between the new micro-LEDs and the display panel, preventing light emission failures caused by temperature fluctuations, thereby maintaining the display module's functionality.
Implementation Method 1
forming a pad structure having an elastic connection property to elastically connect to a light emitting element, and a conductive connection property to provide an electrical connection
Data Source
AI summary
A method for repairing a display module on which light emitting diodes are arranged, includes: removing a defective light emitting diode from among the light emitting diodes from the display module; forming an elastic conductive pad on a panel electrode of the display module that is exposed as the defective light emitting diode is removed; transferring a new light emitting diode to the display module for electrical connection to the elastic conductive pad; covering the new light emitting diode and the elastic conductive pad with a protective layer; and curing the protective layer to maintain an elastic bond between the new light emitting diode and the elastic conductive pad.