μLED Repair via Segmented Substrate and Intermediary Elements
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Solution Overview
Problem
Conventional LED sorting devices are not suitable for micro light-emitting diodes (μLEDs) due to their small dimensions, leading to challenges in identifying and repairing defective μLEDs without damaging the circuit structure or other functional μLEDs during mounting on a circuit board.
Innovation Solution
A photoelectric device comprising a target substrate with connection positions and a repair position, where a supplemental repair element with an electrode is connected to the circuit pattern layer, allowing for the replacement of defective μLEDs without disrupting the surrounding functional elements, using techniques like laser welding and cutting lines to form new circuit connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional LED sorting devices are used for μLEDs, then the sorting process can be simplified, but the measurement precision is insufficient due to the small dimensions of μLEDs
Solution Approach 1:
The patent divides the circuit substrate into multiple connection positions and introduces a separate repair position for each connection position. This segmentation allows the sorting device to focus on detecting only the connection positions where μLEDs are mounted, rather than analyzing the entire substrate, thereby maintaining simplicity while improving detection precision for the small μLED dimensions.
Solution Approach 2:
The patent introduces a supplemental repair element as an intermediary component that can be placed at repair positions adjacent to connection positions. This intermediary element serves as a placeholder or replacement that facilitates the detection and repair process, enabling precise identification of defective μLEDs without requiring complex analysis of the entire array.
2Reliability
If repair operations are performed on defective μLEDs, then the reliability of the photoelectric device is improved, but the risk of damaging the circuit structure or other good μLEDs increases
Solution Approach 1:
The patent segments the repair operation into isolated steps at each connection position and repair position. By treating each defective μLED and its corresponding repair position as an independent unit, the repair process can be performed locally without affecting adjacent good μLEDs or the overall circuit structure, thus improving reliability while minimizing damage risk.
Solution Approach 2:
The patent performs preliminary detection and identification of defective μLEDs before executing repair operations. By pre-identifying which connection positions contain defective μLEDs and preparing the corresponding repair positions in advance, the system can execute precise repair operations that target only the necessary locations, avoiding damage to good μLEDs and circuit structures.
3Productivity
If the pitch and dimension of μLEDs are reduced to increase density, then the productivity of the photoelectric device is improved, but the difficulty of detecting and measuring defective μLEDs increases
Solution Approach 1:
The patent segments the detection task by associating each connection position with a dedicated repair position. This segmentation allows the detection system to focus on specific locations rather than scanning the entire high-density array, making it feasible to detect and measure defective μLEDs even when the pitch and dimensions are reduced to increase device density.
Solution Approach 2:
The supplemental repair element acts as an intermediary that enhances the detectability of defective μLEDs. By placing this element at the repair position adjacent to a connection position, it creates a reference structure that facilitates the detection process, allowing the system to identify defective μLEDs more easily despite their reduced size and increased density.
4Ease of manufacture
If heights of μLEDs are made uneven due to manufacturing variations, then the ease of manufacture is improved, but the stability of the device composition worsens
Solution Approach 1:
The patent addresses the height variation issue by introducing a vertical dimension solution through the supplemental repair element. This element can be positioned at the repair position to compensate for height differences, allowing the device to accommodate manufacturing variations without compromising the stability of the overall composition or requiring strict height uniformity during manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective and efficient repair of μLEDs by replacing defective elements without damaging the circuit structure or other μLEDs, ensuring the photoelectric device operates efficiently and reducing repair costs.
Implementation Method 1
the electrode of the supplemental repair element is connected to the circuit pattern layer by laser welding
Data Source
AI summary
A photoelectric device includes a target substrate, a circuit pattern layer disposed on the target substrate, a plurality of micro photoelectric elements electrically connected to the circuit pattern layer, and a supplemental repair element electrically connected to the circuit pattern layer. The target substrate is configured with a plurality of connection positions and a repair position disposed with an offset with relative to a corresponding one of the connection positions. The offset is greater than or equal to zero. The micro photoelectric elements are individually disposed on at least a part of the connection positions of the target substrate. The supplemental repair element has an electrode disposed on the repair position of the target substrate, and the electrode is connected to the circuit pattern layer. On the target substrate, the supplemental repair element is arbitrary with respect to the micro photoelectric elements.