Self-Assembling MicroLED Display With Residual Electrodes
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Solution Overview
Problem
The challenge lies in creating a stable and efficient active matrix-type display device that can self-assemble semiconductor light-emitting diodes while minimizing parasitic capacitance caused by overlapping assembly electrodes and avoiding the need for temporary transfer onto a separate substrate.
Innovation Solution
The solution involves a display device structure with a base unit, data and gate wires, a power wire, thin-film transistors, and a pair of residual assembly electrodes that do not overlap with the data or power wires, along with specific insulating layers to reduce parasitic capacitance, and a manufacturing method that includes forming and removing assembly electrode extensions to achieve self-assembly without overlapping, thereby reducing parasitic capacitance and maintaining operational stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If assembly electrodes are added for self-assembly of semiconductor light-emitting diodes, then the self-assembly capability is improved, but parasitic capacitance increases causing unstable operation
Solution Approach 1:
The patent extracts and removes the extension portion of the assembly electrode that overlaps with the data wire or power wire. This extraction eliminates the source of parasitic capacitance while preserving the essential self-assembly function provided by the residual assembly electrode, thus resolving the contradiction between automation and reliability.
Solution Approach 2:
The assembly electrode is segmented into two functional parts: the residual assembly electrode that remains for self-assembly and the extension portion that is removed. This segmentation allows the design to maintain self-assembly capability while eliminating the harmful overlapping region that causes parasitic capacitance and operational instability.
2Ease of manufacture
If assembly electrode extension is used for self-assembly, then the self-assembly process is simplified, but parasitic capacitance is generated causing operational instability
Solution Approach 1:
The harmful extension portion of the assembly electrode is extracted and removed after serving its purpose in the self-assembly process. This allows the manufacturing process to benefit from the simplicity of using an extension for assembly, while the final product is free from the parasitic capacitance that the extension would cause.
Solution Approach 2:
The extension portion of the assembly electrode is temporarily used to facilitate self-assembly, then discarded in the removal step. This temporary use allows the process to benefit from the extended electrode's ease of use during assembly, while the final discarding eliminates the source of parasitic capacitance, achieving both manufacturing ease and operational stability.
3Reliability
If multiple insulating layers are added to reduce parasitic capacitance, then operational stability is improved, but device complexity increases
Solution Approach 1:
The patent applies preliminary action by removing the extension portion of the assembly electrode before final device operation. This preliminary removal prevents the generation of parasitic capacitance in the first place, eliminating the need for multiple insulating layers to mitigate the problem, thus achieving operational stability without increasing device complexity.
Solution Approach 2:
Instead of adding multiple insulating layers to mitigate the harmful effect of parasitic capacitance, the patent converts the problem by removing the source of the harm (the extension portion). This approach achieves operational stability through a simpler means, transforming a potential complexity issue into a straightforward design solution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a stable display device operation by eliminating parasitic capacitance and simplifying the manufacturing process by eliminating the need for temporary substrate transfer, enhancing the efficiency of semiconductor light-emitting diode assembly and integration.
Implementation Method 1
a semiconductor light-emitting diode (microLED)
Data Source
AI summary
Discussed is a display device that can include a base unit, a data wire and a gate wire arranged in columns and rows, respectively, and on the base unit to intersect each other, a power wire extending in a same direction as the data wire, thin film transistors connected to the data wire and the gate wire, and a semiconductor light-emitting diode electrically connected to the thin film transistors. A pair of residual assembly electrodes overlapping the semiconductor light-emitting diode are also provided.