Micro-LED Processing Scanner With Synchronized In-Line Detection
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Solution Overview
Problem
Current methods for processing and inspecting micro-light-emitting diodes (micro-LEDs) are inefficient due to the mismatch between the transfer and inspection processes, with micron-level quick stops being difficult to control and alignment accuracy issues, leading to slower production efficiency.
Innovation Solution
A processing and detecting apparatus that integrates a stage, processing unit, and detection scanner, allowing simultaneous detection during processing by synchronizing the processing scanner with the detection scanner to capture and output detection information at a scanning frequency, enabling simultaneous processing and detection of multiple positions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a three-dimensional platform is used to quickly move the wafer for frame-by-frame capture, then the detection can cover the entire wafer surface, but the micron-level quick stops are difficult to control and alignment accuracy deteriorates
Solution Approach 1:
The patent replaces the mechanical three-dimensional platform movement system with an optical scanning system using a galvanometer. The galvanometer deflects a light spot to scan across the wafer surface, eliminating the need for mechanical stopping and positioning. This substitution of mechanical movement with optical scanning resolves the contradiction by maintaining high detection speed while achieving precise alignment through optical control rather than mechanical control.
2Measurement precision
If the charge-coupled device exposure frame rate is limited to less than dozens of frames per second, then the detection precision is maintained, but the detection speed becomes far less than the transfer process speed
Solution Approach 1:
The patent replaces the frame-by-frame capture method with a scanning light spot method using a galvanometer. Instead of moving the entire wafer and capturing multiple frames, a single light spot scans across the wafer surface, and the CCD captures images at the galvanometer's scanning frequency (tens of kHz). This substitution enables detection speeds matching the transfer process while maintaining precision through the focused light spot.
Solution Approach 2:
The patent introduces dynamic scanning using a galvanometer that can rapidly deflect the light spot across the wafer surface at frequencies in the tens of kHz range. This dynamic approach replaces the static frame-by-frame capture, allowing the detection system to keep up with the high-speed transfer process while maintaining image quality through the scanning mechanism.
3Productivity
If a galvanometer with a prism is used to generate multiple detection light spots, then the field of view of each light spot covers multiple chips, but the detection light spot is different from the laser process light spot, resulting in a multiple-station type system
Solution Approach 1:
The patent merges the processing laser path and the detection light path into a single integrated system. The same galvanometer that controls the processing laser also controls the detection light spot, and both operate along the same optical path. This merging eliminates the need for separate detection stations and enables synchronized processing and detection at the same location, resolving the contradiction between throughput and system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves production efficiency by allowing massive detection during the processing of micro-LEDs, reducing the need for multiple stations and enhancing the processing speed by up to 3-4 times compared to conventional methods.
Implementation Method 1
The processing scanner is configured to scan the sample to be processed. The processing scanner controls the processing unit to process the processing positions sequentially at a scanning frequency.
Implementation Method 2
The information capturing unit synchronously receives a piece of detection information for each processing position through the processing scanner
Implementation Method 3
the scanning output unit is signally connected to the information capturing unit, and outputs each piece of detection information at the scanning frequency
Data Source
AI summary
A processing and detecting apparatus includes a stage, a processing unit, a processing scanner and at least one detection scanner. The stage is configured to place a sample to be processed. A surface of the sample to be processed has a plurality of processing positions. The processing unit is disposed relative to the stage to process the sample to be processed. The processing scanner is configured to scan the sample to be processed. The processing scanner controls the processing unit to process the processing positions sequentially at a scanning frequency. The detection scanner includes an information capturing unit and a scanning output unit. The information capturing unit synchronously receives a piece of detection information for each processing position through the processing scanner, the scanning output unit is signally connected to the information capturing unit, and outputs each piece of detection information at the scanning frequency.