Micro-LED Display Assembly Using Shape-Matched Recesses
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Solution Overview
Problem
The challenge of transferring millions of semiconductor light emitting diodes (LEDs) with a cross-sectional area or diameter of 100 μm or less for large-area displays is difficult due to the lack of efficient assembly methods, particularly when self-assembly is required for high efficiency and large-screen displays.
Innovation Solution
A display device structure is designed with recessed portions and solder portions on both the semiconductor LEDs and substrate, incorporating ohmic electrodes and a magnetic layer to facilitate electrical connection and stable assembly, allowing for self-assembly of LEDs emitting different colors simultaneously.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to assemble semiconductor light emitting diodes, then assembly efficiency is improved and large-screen display is enabled, but difficulty in transferring millions of small-sized LEDs remains
Solution Approach 1:
The invention divides the large-scale transfer task into manageable units by patterning the substrate with arrays of recessed portions corresponding to individual LED positions. This segmentation allows systematic placement and transfer of millions of small LEDs across the entire display area through organized, position-specific assembly operations.
Solution Approach 2:
The invention introduces an intermediary assembly substrate with patterned recessed portions that facilitates the transfer process. This intermediate structure serves as a temporary platform where LEDs can be self-assembled and then transferred to the final display substrate, simplifying the overall transfer operation for large numbers of components.
2Loss of time
If semiconductor light emitting diodes with different colors are assembled simultaneously, then assembly time is reduced, but position selectivity and precision are required
Solution Approach 1:
The invention implements local quality by providing different recessed portion geometries (different shapes, sizes, or orientations) at different positions on the substrate. This allows semiconductor light emitting diodes emitting different colors to be simultaneously self-assembled at their correct positions through geometric matching, achieving both time efficiency and position precision.
Solution Approach 2:
The invention employs asymmetry by designing recessed portions with non-uniform, position-specific geometries that correspond to the specific color and type of LED intended for that location. This asymmetric patterning enables automatic position and orientation selection during self-assembly, ensuring correct placement of multi-color LEDs simultaneously.
3Reliability
If recessed portions and solder portions are designed for electrical connection, then electrical connectivity is achieved, but structural complexity increases
Solution Approach 1:
The invention merges multiple functions into unified structures: the recessed portions serve both mechanical positioning and electrical connection functions by integrating solder portions within them. This combination eliminates the need for separate positioning and electrical connection features, reducing overall structural complexity while achieving reliable electrical connectivity.
Solution Approach 2:
The recessed portions are designed as multi-functional elements that simultaneously provide mechanical support, positional alignment, and electrical connection through integrated solder portions. This universal design approach allows a single structural feature to fulfill multiple requirements, simplifying the overall device architecture.
4Stability of the object's composition
If magnetic layer is added to prevent separation of assembled LEDs, then assembly stability is improved, but manufacturing complexity increases
Solution Approach 1:
The invention uses composite materials by incorporating a magnetic layer into the substrate or LED structure. This magnetic component works together with the mechanical recessed portion structure to provide both physical retention and magnetic holding force, enhancing assembly stability while adding only a thin functional layer that can be deposited using standard manufacturing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure enables rapid assembly of LEDs with different colors by self-assembly, ensuring electrical connection and stability, thereby reducing assembly time and improving transfer yield for large-area displays.
Implementation Method 1
a solder portion of the substrate may include a magnetic layer
Data Source
AI summary
Discussed is a display device including a base portion, assembled electrodes extending along one direction on the base portion, a dielectric layer to cover the assembled electrodes, a partition wall portion on the dielectric layer while forming a plurality of cells, and a plurality of semiconductor light emitting diodes seated in the plurality of cells, respectively and to emit light of different colors. The plurality of semiconductor light emitting diodes emitting different colors include recessed portions having different shapes. Further, a surface of the plurality of cells includes a solder portion protruding to correspond to the recessed portions of the plurality of semiconductor light emitting diodes seated in the plurality of cells, respectively.