Micro-LED Assembly Substrate Using Shared Electrodes and Self-Assembly
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Solution Overview
Problem
The challenge of transferring millions of semiconductor light emitting devices for large-area displays is difficult, and existing methods like pick & place and laser lift-off are inefficient, particularly for micro LED displays, which require high-resolution and large-area implementations.
Innovation Solution
A substrate design with assembly electrodes and cells arranged in rows and columns, utilizing magnetic and electric fields to self-assemble semiconductor light emitting devices, reducing the number of electrodes needed and allowing for high-resolution display manufacturing with simplified processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional transfer methods (pick & place, laser lift-off) are used for micro LED displays, then the transfer process can be performed, but the efficiency is low and manufacturing complexity increases
Solution Approach 1:
The patent implements self-assembly where semiconductor light emitting devices automatically find their correct positions on the substrate through fluidic manipulation and magnetic field guidance, eliminating the need for complex mechanical pick-and-place operations or laser lift-off processes. The devices selforganize into the desired array configuration through the interaction of magnetic forces and fluid flow, dramatically simplifying the manufacturing process while maintaining high transfer efficiency
Solution Approach 2:
The patent replaces traditional mechanical transfer methods (pick & place) and thermal/optical methods (laser lift-off) with a fluidic-magnetic field based self-assembly system. Semiconductor light emitting devices are manipulated in a fluid environment using magnetic fields to guide their movement and positioning, substituting complex mechanical and thermal systems with a more efficient field-based approach
2Manufacturing precision
If the number of assembly electrodes is increased to improve positioning precision, then manufacturing precision improves, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent makes assembly electrodes multi-functional by designing them to perform both positioning and assembly functions simultaneously. The same electrodes that position the semiconductor light emitting devices also guide their self-assembly into the final configuration. This eliminates the need for separate positioning and assembly electrode systems, reducing overall device complexity while maintaining high positioning precision through the combined functionality of the electrodes
Solution Approach 2:
The patent changes the operational parameters of the assembly electrodes by applying magnetic fields and fluidic forces in combination with electrical signals. Instead of relying solely on electrical actuation of numerous electrodes, the system uses modified parameters including magnetic field strength, fluid flow velocity, and electrical voltage combinations to achieve precise positioning with fewer electrodes, thereby reducing system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high-resolution large-area displays with improved transfer yield and reduced manufacturing costs by efficiently seating semiconductor light emitting devices at denser intervals using magnetic and electric fields.
Implementation Method 1
utilizing magnetic and electric fields to self-assemble semiconductor light emitting devices
Implementation Method 2
utilizing magnetic and electric fields to self-assemble semiconductor light emitting devices
Implementation Method 3
a self-assembly method is a method in which a semiconductor light emitting device finds its own position within a fluid
Data Source
AI summary
A display device manufacturing substrate according to the present disclosure comprises: a base part; assembly electrodes which extend in one direction and which are arranged on the base part; a dielectric layer formed on the base part to cover the assembly electrodes; a partitioning part formed on the dielectric layer; and cells which are formed in a plurality of rows and columns by means of the partitioning part, and on which semiconductor light-emitting elements are loaded, wherein the assembly electrodes extend in either the row direction or the column direction to overlap cells in the extending direction, and the assembly electrodes comprise a first assembly electrode overlapping cells that form one row or column, and a second assembly electrode simultaneously overlapping cells that form different rows or columns which are adjacent.