Micro-LED Chip Layout With Shared Emission Layer Isolation
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Solution Overview
Problem
Existing micro-LED structures face challenges in optimizing the alignment and contact between conductive layers and light emitting layers, which can affect efficiency and reliability.
Innovation Solution
The micro-LED structure features a light emitting layer that extends horizontally away from the edges of the conductive layers, ensuring non-contact alignment, and may include spacers and isolation structures to enhance alignment and separation between adjacent micro-LEDs, with conductive layers aligned at edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light emitting layer contacts the conductive layers at edges, then electrical connection is improved, but manufacturing precision and alignment reliability deteriorate
Solution Approach 1:
The patent introduces spacers as intermediary elements positioned between the conductive layers and the light emitting layer. These spacers act as mediators that maintain a controlled gap, preventing direct contact at the edges while ensuring proper alignment. The spacers provide physical reference points that improve manufacturing precision without compromising electrical connection reliability.
Solution Approach 2:
The conductive layers are configured with edges that are preliminarily positioned and aligned before the light emitting layer is formed. This preliminary alignment action ensures that when the light emitting layer is subsequently deposited, the edges are already in the correct positions, improving both manufacturing precision and alignment reliability without requiring complex post-processing.
2Stability of the object's composition
If the light emitting layer extends horizontally away from conductive layer edges, then structural integrity is improved, but device complexity increases
Solution Approach 1:
The patent segments the device into distinct functional zones: conductive layers with defined edges, spacers positioned at specific locations, and a light emitting layer that extends horizontally away from the conductive layer edges. This segmentation allows each component to be optimized independently while maintaining overall structural integrity, without requiring complex interactions between layers.
Solution Approach 2:
The light emitting layer is configured to extend horizontally away from the conductive layer edges in the planar dimension, rather than vertically overlapping them. This dimensional change simplifies the vertical layer configuration while maintaining structural integrity through horizontal extension, reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the efficiency and reliability of micro-LEDs by minimizing contact points and enhancing structural integrity, allowing for better performance and integration in optical elements.
Implementation Method 1
A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. An isolation structure is formed between adjacent micro-LEDs, at least a portion of the isolation structure being formed in the light emitting layer.