Micro-LED Display Assembly With Sidewall Connection Structure
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Solution Overview
Problem
Existing display devices face challenges in aligning ultra-small light emitting devices on substrates due to limited space for electrode wiring, leading to disconnection and poor lighting, especially with self-assembly methods, and high-temperature processes result in weak adhesion and tilting of light emitting devices.
Innovation Solution
A display device with a double barrier wall structure and connection part along the perimeter of semiconductor light emitting devices, utilizing insulating layers and a groove to ensure stable electrical connection without disconnection, even at reduced sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the gap between assembly wirings is reduced for high-resolution displays, then display resolution is improved, but space for electrode wiring is eliminated causing connection failure
Solution Approach 1:
The patent transitions from planar electrode wiring to three-dimensional side surface connection. The connection part extends along the side surface of the light emitting device, utilizing the vertical dimension to achieve electrical connection without occupying horizontal space between assembly wirings, thereby maintaining high display resolution while enabling reliable electrical connection.
2Temperature
If low-melting point solder is used for bonding electrodes to avoid high-temperature process limitations, then processing temperature is reduced, but adhesion strength decreases causing light emitting device detachment
Solution Approach 1:
The patent changes the bonding mechanism from thermal diffusion bonding (solder) to mechanical interlocking and adhesive bonding. The connection part's extended structure along the side surface provides mechanical anchoring, while the adhesive layer provides chemical bonding, eliminating the need for high-temperature soldering while maintaining strong adhesion.
3Device complexity
If bonding electrode thickness is not maintained uniformly during bonding process, then manufacturing complexity is reduced, but light emitting device tilting occurs causing poor lighting
Solution Approach 1:
The connection part is pre-formed with a specific extended structure along the side surface of the light emitting device before the bonding process. This preliminary structural preparation ensures that during bonding, the connection part naturally maintains proper alignment and spacing, preventing tilting without requiring complex real-time thickness control during the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable electrical connection and improved brightness uniformity by maximizing contact area, preventing disconnection and tilting, and maintaining high resolution.
Implementation Method 1
the self-assembly method of transferring a light emitting device onto a substrate using a magnetic material (or magnet)
Data Source
AI summary
A display device includes a substrate, a first assembly wiring and second assembly wiring on the substrate, a first insulating layer on the first and second assembly wirings, a barrier wall comprising a hole on the first insulating layer, a semiconductor light emitting device in the hole, and a connection part is configured to electrically connect a side of the semiconductor light emitting device and at least one assembly wiring of the first and second assembly wirings. A gap between an inner surface of the hole and an outer surface of the semiconductor light emitting device is 50% to 200% of a thickness of the semiconductor light emitting device.