Micro-LED Mesa Sidewall Epitaxy for Directional Light Extraction

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Solution Overview

Problem

Micro-LEDs, particularly AlGaInP-based red light-emitting diodes, face challenges in improving collected light extraction efficiencies due to high surface recombination rates, total internal reflection, and optical crosstalk, which reduce their internal and external quantum efficiencies as device sizes decrease.

Innovation Solution

The use of reduced quantum well sizes and a combination of high-refractive index and low-refractive index passivation layers, along with micro-lenses, to enhance light extraction by increasing the optical distance between the active region and sidewall metal reflectors, reducing surface plasmon resonance, and improving collimation of emitted light.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If device size is reduced to increase packing density, then high resolution is achieved, but surface recombination rate increases reducing quantum efficiency

Engineering Contradiction:
Improvepacking densityVSAvoidquantum efficiency
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent applies local quality by creating a mesa structure with different refractive index regions: the core mesa region maintains high refractive index for light generation, while the sidewall passivation layer provides a lower refractive index region. This local differentiation addresses surface recombination at the sidewalls without affecting the overall device size and packing density.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining the semiconductor mesa structure with a passivation layer of different refractive index. This composite structure reduces surface recombination at the sidewalls while maintaining the small device size needed for high packing density, thereby preserving quantum efficiency.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If device size is reduced to increase packing density, then high resolution is achieved, but total internal reflection increases reducing light extraction efficiency

Engineering Contradiction:
Improvepacking densityVSAvoidlight extraction efficiency
Core Design Contradiction:
Manufacturing precisionVSLoss of energy

Solution Approach 1:

The patent creates a local refractive index gradient at the sidewalls through the passivation layer. This local quality change allows light to escape more efficiently at the sidewall regions without requiring larger device dimensions, thus maintaining high packing density while improving light extraction.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the refractive index parameter at the sidewall region by introducing a passivation layer with lower refractive index than the mesa core. This parameter change reduces total internal reflection at the sidewalls, improving light extraction efficiency without increasing device size.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If device size is reduced to increase packing density, then high resolution is achieved, but optical crosstalk increases reducing directional control

Engineering Contradiction:
Improvepacking densityVSAvoidoptical crosstalk
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent applies local quality by confining light emission to a specific directional pattern through the mesa structure geometry and sidewall passivation. This localized light control prevents optical crosstalk between adjacent pixels while maintaining high packing density, as each micro-LED emits light in a controlled direction rather than omnidirectionally.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses the vertical dimension of the mesa structure to control light directionality. By creating a three-dimensional mesa geometry with specific sidewall angles and heights, the patent directs light emission vertically while suppressing lateral emission, thereby reducing optical crosstalk between adjacent pixels in the high-density array.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If passivation layer thickness is increased to reduce surface recombination, then quantum efficiency improves, but optical distance increases reducing extraction efficiency

Engineering Contradiction:
Improvequantum efficiencyVSAvoidlight extraction efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent optimizes the thickness parameter of the passivation layer to achieve the right balance. By controlling the passivation layer thickness to be sufficient for reducing surface recombination but not excessively thick, the patent maintains both high quantum efficiency and good light extraction efficiency. The specific thickness is tuned based on the refractive index difference and device geometry.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly increases the collected light extraction efficiency, improves tolerance to lens width variations, and reduces optical crosstalk, resulting in enhanced light emission directionality and overall efficiency of micro-LEDs.

Implementation Method 1

an insulator layer that includes an undoped semiconductor passivation layer grown on sidewalls of the semiconductor mesa structure

Methodology Applied
Scientific EffectSurface passivation:

Implementation Method 2

a dielectric passivation layer characterized by a refractive index lower than a refractive index of the undoped semiconductor passivation layer

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 3

reducing surface plasmon resonance

Methodology Applied
Scientific EffectSurface plasmon resonance:

Implementation Method 4

a reflective metal layer deposited on the dielectric passivation layer

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 5

a micro-lens configured to collimate the visible light emitted by the active region

Methodology Applied
Scientific EffectCollimation: Lens

Implementation Method 6

an active region configured to emit visible light

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 7

The sidewalls of the semiconductor mesa structure may be outwardly tilted from the p-type semiconductor layer to the n-type semiconductor layer

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Data Source

PatentUS12148863B2Directional light extraction from micro-LED via localization of light emitting area using mesa sidewall epitaxy
Publication Date: 2024.11.19 META PLATFORMS TECHNOLOGIES LLC
  • US12148863B2 patent drawing
  • US12148863B2 patent drawing
  • US12148863B2 patent drawing

AI summary

A micro-light emitting diode includes a semiconductor mesa structure that includes at least a portion of an n-type semiconductor layer, an active region configured to emit visible light, and a p-type semiconductor layer. The micro-LED device also includes an insulator layer that includes an undoped semiconductor passivation layer grown on sidewalls of the semiconductor mesa structure, and a dielectric passivation layer characterized by a refractive index lower than a refractive index of the undoped semiconductor passivation layer. The micro-LED device further includes a reflective metal layer deposited on the dielectric passivation layer, and a micro-lens configured to collimate the visible light emitted by the active region, where a ratio between a width of the micro-lens and a width of the active region may be greater than about 1.5.