Micro-LED Cell Solder Interconnect for Precise Self-Assembly
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Solution Overview
Problem
Existing display technologies face challenges such as slow response time, low light efficiency, short lifespan, and low yield in large-area displays, particularly with semiconductor light-emitting elements which require efficient transfer and assembly methods.
Innovation Solution
A display device and manufacturing method that involves seating vertical semiconductor light-emitting elements directly on a final substrate using a self-assembly method, and forming a solder layer within the cell to electrically connect the semiconductor light-emitting element to a lower wiring, enhancing electrical connectivity and current supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer semiconductor light-emitting elements, then productivity is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent introduces an assembly substrate as an intermediary between the semiconductor light-emitting elements and the final substrate. Elements are first self-assembled on the assembly substrate using fluidic forces, then transferred to the final substrate. This mediator enables high-productivity self-assembly while maintaining positioning accuracy through controlled transfer processes.
Solution Approach 2:
The transfer process is divided into two separate stages: first self-assembly on an assembly substrate, then transfer to the final substrate. This segmentation allows each stage to be optimized independently - the first stage maximizes productivity through self-assembly, while the second stage ensures positioning precision during transfer.
2Device complexity
If direct assembly method is used on final substrate, then device complexity is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The assembly substrate serves as a mediator that enables precise positioning and orientation of semiconductor light-emitting elements before final transfer. This intermediary structure provides a controlled environment for accurate assembly without requiring the final substrate to have complex positioning features.
Solution Approach 2:
The semiconductor light-emitting elements are preliminarily assembled and positioned on the assembly substrate before being transferred to the final substrate. This preliminary action ensures correct orientation and positioning is achieved in advance, maintaining manufacturing precision while keeping the overall process relatively simple.
3Reliability
If solder layer is filled in cell after self-assembly, then electrical connectivity is improved, but device complexity increases
Solution Approach 1:
The solder layer is preliminarily formed in the cell before the semiconductor light-emitting element is seated through self-assembly. This preliminary action ensures that the electrical connection pathway is prepared in advance, improving reliability while the self-assembly process automatically ensures proper contact without requiring additional complex alignment steps.
Solution Approach 2:
The self-assembly process allows the semiconductor light-emitting element to automatically position itself and make contact with the solder layer in the cell. This self-service mechanism ensures reliable electrical connection without requiring complex external alignment or positioning systems, keeping the manufacturing process relatively simple.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient electrical connection of semiconductor light-emitting elements to the substrate, improving the assembly process and enhancing the display's performance by supplementing current supply to the elements.
Implementation Method 1
semiconductor light-emitting elements having a size of several to tens of micrometers
Implementation Method 2
the self-assembly method, which is a method in which the semiconductor light-emitting element locates themselves in a fluid
Implementation Method 3
a solder layer electrically connecting the semiconductor light-emitting element seated in the cell and the first wiring electrode overlapping the cell is filled in the cell
Data Source
AI summary
Discussed is a display device including a base portion; assembly electrodes that extend in one direction and are disposed on the base portion at predetermined intervals; a dielectric layer deposited on the base portion to cover the assembly electrodes; a first wiring electrode that extends in the same direction as the assembly electrodes and is disposed on the dielectric layer so as not to overlap the assembly electrodes; a partition wall portion deposited on the dielectric layer while arranging cells at predetermined intervals to overlap the assembly electrodes and the first wiring electrode along an extension direction of the assembly electrodes; and semiconductor light-emitting elements seated in the cells, respectively, wherein a solder layer electrically connecting a semiconductor light-emitting element seated in a cell and the first wiring electrode overlapping the cell is filled in the cell from among the plurality semiconductor light emitting elements and the cells.