Micro LED Display Panel Stepped Wiring for Seamless Tiling
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Solution Overview
Problem
Current display technologies face challenges in minimizing the bezel area and achieving high micro LED packing density, particularly in large display devices, where seams can appear between connected panels, reducing display quality.
Innovation Solution
A bezel-less display panel design that forms wiring on both surfaces of a substrate through a stepped part, allowing for the connection of micro LEDs to a driver IC on the outer side, and uses a flexible or glass rear substrate with a protection layer to minimize dummy areas and maintain identical pixel pitches across panels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a bezel area is secured at the edge of the TFT substrate for connecting driver IC, then the connection between TFT substrate and driver IC is ensured, but the active display area is reduced
Solution Approach 1:
The patent moves the driver IC bonding area from the front surface (2D plane) to the rear surface of the TFT substrate by creating a stepped part. This dimensional transition allows wiring to extend through the stepped region, enabling connection without occupying front surface area, thus eliminating the bezel area while maintaining connection functionality.
Solution Approach 2:
The substrate is divided into different levels creating a stepped part with a first surface and a second surface at different heights. This segmentation allows the wiring to be distributed across different levels, with some wiring on the front surface and other wiring on the rear surface, enabling compact routing without increasing overall footprint.
2Quantity of substance
If wiring is formed only on the front surface of the substrate, then the structure is simple, but the micro LED packing density is limited due to space constraints
Solution Approach 1:
The wiring structure transitions from a single-plane (2D) configuration to a multi-level (3D) configuration by utilizing both the front surface and rear surface of the substrate through the stepped part. This allows wiring to be routed in three dimensions, increasing the effective wiring capacity without increasing the footprint area, thereby enabling higher micro LED packing density.
Solution Approach 2:
The wiring structure is nested within the stepped part of the substrate, where wiring is embedded in the vertical transition region. This nesting approach allows wiring to occupy the vertical space within the stepped part rather than consuming horizontal space, maximizing the use of available volume for both wiring and micro LED placement.
3Area of stationary object
If multiple display panels are connected to form a large display device, then the display size is increased, but seams appear between adjacent panels reducing display quality
Solution Approach 1:
The stepped part is created locally at specific regions of the substrate where wiring connections are needed, rather than uniformly across the entire substrate. This localized structural modification allows precise control of wiring routing at connection points while maintaining uniform pixel pitch and display quality across the entire panel surface, enabling seamless tiling when multiple panels are connected.
Data Source
AI summary
A display substrate is disclosed. The disclosed display substrate can comprise: a thin film transistor substrate; a plurality of micro LEDs arranged on one surface of the thin film transistor substrate; a rear substrate having one surface coupled to the other surface of the thin film transistor substrate, and having at least a part of an edge protruding further than the edge of the thin film transistor substrate so as to form a stepped part together with the thin film transistor substrate; and a plurality of wirings formed on the stepped part and the other surface of the rear substrate so as to electrically connect the one surface of the thin film transistor substrate and the other surface of the rear substrate.