MicroLED Doping and Strain Tuning for High-Speed Inter-Chip Links

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Solution Overview

Problem

Lasers are not suitable for short-distance optical communications, such as chip-to-chip communications, due to their narrow linewidth and single spatial mode limitations, which can lead to inefficiencies in signal transmission and modulation speeds.

Innovation Solution

The development of a microLED with a p-type layer, n-type layer, quantum well layers, and barrier layers doped with specific dopants like Magnesium and Silicon, and applying external tensile strain to reduce lattice mismatch strain, enhancing modulation bandwidth and speed for optical communication systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If lasers are used for optical communications, then high-speed signal transmission and long-distance communication are achieved, but the system becomes unsuitable for very short distances such as chip-to-chip communications

Engineering Contradiction:
Improvesignal transmission speedVSAvoidadaptability to different communication distances
Core Design Contradiction:
SpeedVSAdaptability or versatility

Solution Approach 1:

The patent applies parameter changes by modifying the LED structure through doping quantum well and barrier layers with dopants like Magnesium and Silicon, and by applying external tensile strain. These parameter changes transform the LED's optical properties to achieve laser-like performance characteristics including narrower linewidth and higher modulation bandwidth, enabling the device to function effectively for short-distance chip-to-chip communications while maintaining adaptability across different communication scenarios

Inventive Principle:
Principle #35Parameter changes

2Speed

If narrow linewidth laser is used, then high-speed signals can pass through dispersive media for long distances, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvesignal transmission speedVSAvoiddevice structure complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent employs the copying principle by replicating the functional characteristics of lasers (narrow linewidth, high-speed modulation) using LED technology. Instead of using complex laser structures, the invention creates a simplified device that copies the essential performance traits of lasers through doping and strain engineering, achieving similar signal transmission capabilities with reduced device complexity and manufacturing difficulty

Inventive Principle:
Principle #26Copying

Solution Approach 2:

The patent applies parameter changes by modifying the LED structure through doping quantum well and barrier layers with dopants like Magnesium and Silicon, and by applying external tensile strain. These parameter changes transform the LED's optical properties to achieve laser-like performance characteristics including narrower linewidth and higher modulation bandwidth, enabling the device to function effectively for short-distance chip-to-chip communications while maintaining adaptability across different communication scenarios

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If standard LED structure is used, then manufacturing is simpler, but modulation bandwidth and speed are insufficient for high-speed optical communication

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmodulation bandwidth
Core Design Contradiction:
Ease of manufactureVSSpeed

Solution Approach 1:

The patent applies local quality by introducing dopants (Magnesium and Silicon) specifically into the quantum well and barrier layers, and by applying external tensile strain to specific regions of the LED structure. These localized modifications enhance the modulation bandwidth and speed in the critical active regions without fundamentally changing the overall LED manufacturing process, thus maintaining ease of manufacture while achieving high-speed performance

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies parameter changes by modifying the LED structure through doping quantum well and barrier layers with dopants like Magnesium and Silicon, and by applying external tensile strain. These parameter changes transform the LED's optical properties to achieve laser-like performance characteristics including narrower linewidth and higher modulation bandwidth, enabling the device to function effectively for short-distance chip-to-chip communications while maintaining adaptability across different communication scenarios

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The microLED achieves improved modulation frequency and internal quantum efficiency, enabling faster data transmission and reduced carrier recombination time, suitable for high-speed inter-chip communications.

Implementation Method 1

The at least one quantum well layer and at least one barrier layer between the p type layer and the n type layer, at least one of the quantum well layer and the barrier layer doped with a dopant

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

an external tensile strain is applied parallel to a plane defined by an interface of the quantum well layer and the barrier layer, such that the applied strain reduces strain due to mismatch of the lattice of the InGaN of the quantum well layer and the GaN of the barrier layer

Methodology Applied
Scientific EffectStrain engineering: Elasticity

Data Source

PatentUS12034096B2Enhanced microLEDs for inter-chip communications
Publication Date: 2024.07.09 AVICENATECH CORP
  • US12034096B2 patent drawing
  • US12034096B2 patent drawing
  • US12034096B2 patent drawing

AI summary

An LED may be optimized for high speed operation for optical communication systems in a variety of ways. The LED, which may be a microLED, may include dopants and dopant levels allowing for increased speed of operation, the LED may include interlayers, and the LED may include other features.