Micro-LED Bonding Pad Layout for Uniform Sub-Pixel Repair
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Solution Overview
Problem
In micro-LED display panels, the difference in light-emitting intensities of micro light-emitting diodes (micro-LEDs) in various directions and the non-symmetric positioning of main and backup bonding pads relative to sub-pixels lead to inconsistent light-emitting effects after sub-pixel repair, affecting display uniformity.
Innovation Solution
The display panel is designed with main and backup bonding pads symmetrically positioned relative to sub-pixels, ensuring that the micro-LEDs connected to these pads have the same light-emitting effect. This symmetry minimizes differences in light-emitting intensity and maintains display uniformity even after sub-pixel repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If the main bonding pad and backup bonding pad are positioned at different locations relative to the sub-pixel, then the sub-pixel can be repaired by switching to the backup bonding pad, but the light-emitting effect of the sub-pixel after repair is significantly different from before repair, affecting display uniformity
Solution Approach 1:
The patent applies asymmetry in reverse by deliberately creating symmetry between the main bonding pad and backup bonding pad positions. Both bonding pads are positioned at the same location relative to their respective sub-pixels, ensuring that when a micro-LED is replaced from the main bonding pad to the backup bonding pad, the light-emitting characteristics remain consistent. This symmetric positioning resolves the contradiction by maintaining display uniformity while preserving repair capability.
2Manufacturing precision
If the main bonding pad and backup bonding pad are positioned symmetrically with respect to the sub-pixel, then the light-emitting effect remains consistent after repair, but the positioning precision and alignment complexity increase
Solution Approach 1:
The patent segments the bonding pad structure into multiple identical units (main bonding pad and backup bonding pad), each positioned symmetrically relative to their respective sub-pixels. This segmentation approach simplifies the overall positioning complexity by repeating a standardized configuration rather than creating unique asymmetric positions for each bonding pad type.
Solution Approach 2:
The patent changes the positioning parameter from asymmetric to symmetric arrangement, where the distance and orientation of the main bonding pad and backup bonding pad relative to the sub-pixel are made identical. This parameter change ensures consistent light-emitting characteristics while the regular repeating pattern actually reduces alignment complexity compared to asymmetric arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The symmetric arrangement of bonding pads ensures that the light-emitting effect of sub-pixels remains consistent before and after repair, thereby maintaining display uniformity and improving the overall display performance.
Implementation Method 1
The micro light-emitting diode has different light-emitting intensities in different directions
Data Source
AI summary
A display panel includes a first substrate. The first substrate includes multiple sub-pixel areas arranged in an array. At least one of the multiple sub-pixel areas includes a main bonding pad and a backup bonding pad which are disposed on the first substrate; and a micro light-emitting diode electrically connected to the main bonding pad or the backup bonding pad. The main bonding pad and the backup bonding pad are in a first symmetric manner about a first symmetric reference object. The sub-pixel area is in a second symmetric manner about a second symmetric reference object. The first symmetric manner is the same as the second symmetric manner. The distance between the vertical projection of the first symmetric reference object on the first substrate and the vertical projection of the second symmetric reference object on the first substrate is S1, and S1≤10 μm.