Micro-LED Display Assembly With Redundant Sub-Pixel Repair
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Solution Overview
Problem
The implementation of micro-LED technology in display devices faces challenges due to defects in LEDs, which can lead to unwanted impacts on the display quality, and existing manufacturing methods lack efficient processes for defect detection and repair during the LED placement and layer formation in display devices.
Innovation Solution
A method for manufacturing display devices that involves integrated processes including LED placement, testing, defect repair, and layer formation, where at least two LEDs are placed at each sub-pixel location, allowing for electrical isolation of defective LEDs through passivation or laser cutting, ensuring redundancy and minimizing defective LED impacts, and incorporating additional layers like light guides and wavelength converters for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If micro-LED technology is implemented in display devices, then display quality and brightness are improved, but defects in LEDs cause unwanted impacts on display quality
Solution Approach 1:
The patent implements different functional layers (first and second color conversion layers) at different locations within the display structure to convert blue LED light into different colors (green and red respectively). This local differentiation allows the system to maintain high brightness while compensating for LED defects through spatial distribution of color conversion functions
Solution Approach 2:
The patent incorporates multiple color conversion layers and auxiliary layers before the light exits the display, creating redundant pathways for light conversion. This beforehand cushioning ensures that if one LED or color conversion layer is defective, other layers can compensate to maintain overall display quality and brightness uniformity
2Ease of manufacture
If existing manufacturing methods are used for LED placement, then production is simple, but efficient processes for defect detection and repair during placement are lacking
Solution Approach 1:
The patent performs defect detection and repair operations before final assembly completion. By incorporating testing and repair steps into the manufacturing flow before the display is finalized, defects can be identified and corrected while the device is still accessible, maintaining manufacturing simplicity while enabling effective quality control
Solution Approach 2:
The patent introduces auxiliary layers and intermediate structures that facilitate both the manufacturing process and defect detection. These intermediary elements serve dual purposes: they assist in the assembly process and provide means for detecting and addressing defects during manufacturing
3Reliability
If at least two LEDs are placed at each sub-pixel location, then redundancy is ensured and defective LED impacts are minimized, but device complexity increases
Solution Approach 1:
The patent combines multiple LEDs and color conversion layers into an integrated multi-layer structure at each sub-pixel location. By merging the first and second color conversion layers with the LEDs in a stacked configuration, the system achieves redundancy while managing complexity through integrated design rather than separate components
Solution Approach 2:
The patent transitions from a planar arrangement to a three-dimensional stacked structure with multiple layers (LEDs, first color conversion layer, second color conversion layer, auxiliary layers). This dimensional change allows redundancy to be achieved vertically within each sub-pixel rather than horizontally across multiple sub-pixels, managing complexity through compact vertical integration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances display device quality by ensuring that even if one LED is defective, the other can function, and additional layers improve light emission uniformity and color spectrum sharpness, addressing the technical challenges of LED defects and manufacturing efficiency.
Implementation Method 1
a laser beam is provided to cut the common electrode and electrically isolate the first electrical contact of the defective LED from the common electrode
Data Source
AI summary
Methods for manufacturing an electronic device are provided. A representative method includes providing a substrate. The substrate has an active layer, a first patterned metal layer passing through a passivation layer to electrically connected to the active layer, a second patterned metal layer passing through an insulating layer to electrically connected to the first patterned metal layer, and a metal layer under the second patterned metal layer. A part of the metal layer does not serve as a portion of a thin film transistor, and the part of the metal layer serves as a portion of a gate line. The method includes providing a carrier substrate supporting a plurality of elements, conducting a testing to the elements, transferring the elements from the carrier substrate to the second patterned metal layer of the substrate, and fixing the elements to the substrate.