MicroLED Display Substrate Layout for Bezel-Free High Pixel Density
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Solution Overview
Problem
Current microLED display fabrication techniques result in large bezels and low-resolution displays due to the occupation of substrate space by electrical connections and pixel controllers, limiting the reduction of the non-interactive border and overall display size.
Innovation Solution
Deep etching of the display substrate from one side to the other creates holes to relocate electrical connections and pixel controllers to the opposite side, freeing up space for more pixels and reducing bezel size, thereby achieving a true-bezel-free and infinitely high-resolution display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If electrical connections and pixel controllers are placed on the substrate surface, then electrical connectivity is achieved, but the bezel size increases and display area decreases
Solution Approach 1:
The patent transitions electrical connections from a two-dimensional surface layout to a three-dimensional structure by routing them through holes drilled through the substrate thickness. This vertical routing eliminates the need for lateral space occupation, allowing pixels to be placed right up to the substrate edges and achieving true bezel-free display with maximum display area.
2Manufacturing precision
If more pixels are placed on the substrate, then resolution increases, but electrical connection space requirements conflict with pixel placement
Solution Approach 1:
By moving electrical connections to the vertical dimension (through-substrate holes), the patent frees up the entire substrate surface area for pixel placement. This enables pixels to be positioned at the extreme edges of the substrate, maximizing pixel density and achieving infinitely high resolution without sacrificing connection functionality.
3Length of stationary object
If traditional routing techniques are used to reduce bezel, then some bezel reduction is achieved, but true bezel-free display is not attained
Solution Approach 1:
The patent achieves true bezel-free display by transitioning electrical routing from lateral (2D) to vertical (3D) through substrate holes. This approach eliminates the need for bent border areas and complex trace routing, achieving complete bezel removal while maintaining manufacturing feasibility through standard hole-drilling and filling processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes the bezel size, increases the display area, and enhances resolution by allowing for a higher density of pixels on the substrate without increasing the overall device size, resulting in a more efficient and aesthetically appealing electronic display.
Implementation Method 1
The substrate (silicon, glass, flexible film, or any material that can be used as a display substrate) that can be used to place the microLED pixels on it will be deeply etched from one side through another via dry or wet etch or both etch methods, or any method.
Data Source
AI summary
An electronic display with a bezel-free and infinitely high-resolution display (high pixel density per inch) includes a display substrate with an array of display pixels disposed on one side of the display substrate and all or partial electrical connections that connect each pixel (including at least three subpixels: red, blue, and green micro inorganic light-emitting diodes) to power controllers, pixel controllers, etc. are placed on the other side of the substrate via holes etched into the display substrate from the front-side to the backside by either dry or wet etch, or both techniques. At least one level of the electrical circuits on the other side of the substrate can be sunk into the substrate via trenches created by the same etching mentioned above to reduce the display panel's total thickness.