Micro-LED Driving Substrate Wiring for Narrower PCB Traces
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Solution Overview
Problem
The manufacturing process of printed circuit boards limits the miniaturization of wire width and density of Micro-LEDs in backlight substrates, restricting the size and display quality of liquid crystal display devices.
Innovation Solution
A driving substrate with a base, insulating layers, and conductive wires where the conductive wires are formed by stacking seed and growth wires within openings in the insulating layers, allowing for smaller wire widths and increased density of Micro-LEDs, enabling larger substrate sizes and improved display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If printed circuit board manufacturing process is used, then ease of manufacture is maintained, but wire width cannot be reduced and Micro-LED density cannot be increased
Solution Approach 1:
The conductive wire is segmented into two distinct parts: a seed wire formed by conventional PCB processes and a growth wire formed by electroplating. This segmentation allows the wire to achieve smaller dimensions through the electroplating process while maintaining compatibility with existing PCB manufacturing methods for the seed wire portion.
Solution Approach 2:
The invention transitions from planar wire formation to three-dimensional wire formation by stacking the growth wire vertically on the seed wire. This vertical dimension enables reduced wire width and increased Micro-LED density without compromising the horizontal layout flexibility needed for manufacturing.
2Area of stationary object
If printed circuit board size is increased, then substrate area increases, but number of printed circuit boards increases
Solution Approach 1:
Multiple small PCBs are merged into a single large substrate by forming conductive wires that span across what would have been separate board boundaries. The electroplated growth wires enable electrical connections across the entire substrate area, eliminating the need for multiple discrete PCB assemblies.
3Manufacturing precision
If Micro-LED density is increased, then display quality improves, but wire width must be reduced
Solution Approach 1:
The mechanical constraint of minimum wire width in conventional PCB processes is replaced by an electrochemical process (electroplating) that can deposit conductive material with much finer control over dimensions. This substitution enables wire widths small enough to support high Micro-LED density while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for higher density and uniform brightness of Micro-LEDs, enabling larger substrate sizes and improved control over light emission, enhancing the overall display quality and efficiency of liquid crystal display devices.
Implementation Method 1
a growth wire formed by electroplating on the seed wire
Data Source
AI summary
A driving substrate, including: a base; a first insulating layer and first conductive wires on the base; the first insulating layer is provided with openings, the first conductive wires are positioned in the openings, and at any position in a lengthwise direction of the first conductive wires, each side surface of each first conductive wire is in contact with a side surface of the opening, where said each first conductive wire is positioned, at least at a partial height; each first conductive wire includes a seed wire and a growth wire; second conductive wires positioned on a side of the first conductive wires away from the base, each second conductive wire is coupled to one first conductive wire and is provided with a coupling area for coupling a light-emitting unit. A method for manufacturing the driving substrate, a light-emitting substrate and a display device are further provided.