Micro-LED Assembly Substrate for Fast Self-Alignment Transfer
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Solution Overview
Problem
The transfer of millions of micro-LEDs required for large-area displays is challenging due to low success rates and high time requirements in existing methods like pick & place, and self-assembly methods face issues with non-specific binding and gravity effects.
Innovation Solution
A substrate structure with specific electrode configurations and a self-assembly method using magnetic and electric fields to align and seat semiconductor light-emitting devices in cells, allowing for efficient transfer and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pick & place method is used to transfer micro-LEDs, then transfer precision can be maintained, but transfer time increases and productivity decreases
Solution Approach 1:
The patent replaces the mechanical pick & place system with a self-assembly system using magnetic fields. Micro-LEDs are equipped with magnetic particles and are guided by magnetic fields generated by assembly electrodes on the substrate, enabling simultaneous transfer of multiple devices without mechanical manipulation, thus maintaining precision while dramatically increasing transfer speed
Solution Approach 2:
The patent implements self-assembly where micro-LEDs automatically position themselves on the substrate through magnetic field guidance. The devices themselves participate in the transfer process by responding to magnetic fields, eliminating the need for external mechanical manipulation and enabling high-speed parallel transfer
2Productivity
If self-assembly method is used to transfer micro-LEDs, then transfer speed increases, but alignment precision deteriorates due to non-specific binding and gravity effects
Solution Approach 1:
The patent counteracts gravity effects by using magnetic fields to levitate and position micro-LEDs in the fluid medium. The magnetic force balances gravitational pull, allowing precise alignment without gravity-induced errors or non-specific binding, while maintaining high transfer speed through parallel processing
Solution Approach 2:
The patent employs feedback control through magnetic field adjustment. The magnetic field strength and distribution are dynamically controlled to guide micro-LEDs to precise target positions on the substrate, correcting for any deviations and ensuring high alignment precision while maintaining rapid transfer
3Area of stationary object
If millions of micro-LEDs are transferred for large-area display, then display area increases, but transfer complexity and time requirements increase significantly
Solution Approach 1:
The patent segments the transfer process into independent magnetic field-controlled units. Each micro-LED with its magnetic particle responds independently to magnetic fields from assembly electrodes, allowing parallel transfer of millions of devices across large areas without sequential processing bottlenecks, thus maintaining high speed despite scale
Solution Approach 2:
The patent creates a universal transfer system where the same magnetic field-based self-assembly mechanism can transfer any number of micro-LEDs across any display area. The system scales seamlessly from small to large displays without increasing transfer time, as all devices are transferred simultaneously through the same physical principle
4Productivity
If self-assembly method is used for micro-LED transfer, then process efficiency improves, but control over specific positioning deteriorates
Solution Approach 1:
The patent replaces mechanical positioning control with magnetic field control. Magnetic fields provide precise, contactless positioning of micro-LEDs at their target locations on the substrate, maintaining exact positioning control while enabling parallel self-assembly of millions of devices, thus achieving both high efficiency and precise positioning control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves process efficiency by enabling uniform alignment and transfer of semiconductor light-emitting devices, reducing time and increasing yield in large-area display manufacturing.
Implementation Method 1
a magnetic body to move the semiconductor light-emitting device using a magnetic field
Implementation Method 2
applying a voltage to the assembly electrodes to form an electric field, and guiding and seating the semiconductor light-emitting device package in the fluid chamber to a predetermined position on the substrate
Data Source
AI summary
According to the present disclosure, a substrate for manufacturing a display device has a structure in which a semiconductor light-emitting device package composed of a plurality of electrodes and semiconductor light-emitting devices can be uniformly aligned. As a result, according to the present disclosure, a semiconductor light-emitting device package that has been transferred by a pick-and-place method in the related art may be allowed to be transferred through self-assembly, thereby having an effect of improving process efficiency (improving process speed and reducing time).