Micro-LED Transfer Layout Using Thermal Pitch Control and Airflow
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Solution Overview
Problem
The mass transfer process of micro-LEDs faces challenges with pitch control precision and micro-LED damage due to excessive error in stretching methods and pressure issues during roller-based transfer processes, necessitating improved techniques for high-density micro-LED arrangement.
Innovation Solution
A display device and manufacturing method involving a substrate with electrical connection groups, light-emitting elements, a light-transmitting plate, and an adhesive layer, along with a manufacturing equipment that includes a feeding device, a carrying device with a groove structure, and an air blowing device to precisely control the placement and transfer of micro-LEDs using thermal expansion and airflow to manage pitch and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If stretching tape method is used to control pitch of micro-LEDs, then pitch control is achieved, but excessive error occurs leading to poor manufacturing precision
Solution Approach 1:
The patent replaces the mechanical stretching tape method with a thermal expansion-based pitch control system. A carrier substrate with predefined pitch is used, and thermal expansion or contraction is applied to adjust the pitch of micro-LEDs during transfer, eliminating the excessive error associated with mechanical stretching and achieving more precise pitch control.
Solution Approach 2:
The patent changes the physical parameter of the carrier substrate by applying thermal expansion or contraction. By controlling temperature changes, the pitch of the carrier substrate is dynamically adjusted to match the target pitch requirements, thereby achieving precise pitch control without the errors inherent in mechanical stretching methods.
2Productivity
If roller-based transfer process is used to transfer micro-LEDs, then transfer efficiency is improved, but micro-LEDs are damaged due to pressure control issues
Solution Approach 1:
The patent changes the pressure parameter during the transfer process by using a controlled pressure application method. Instead of uniform high pressure from rollers, the system applies pressure selectively and controllably, ensuring efficient transfer while preventing damage to the micro-LEDs through optimized pressure parameters.
Solution Approach 2:
The patent introduces a carrier substrate as an intermediary between the micro-LEDs and the transfer mechanism. This carrier substrate facilitates the transfer process by providing a stable platform that enables efficient transfer while protecting micro-LEDs from direct contact with high-pressure rollers, thus maintaining their integrity.
3Quantity of substance
If high-density arrangement of micro-LEDs is required, then display resolution is improved, but pitch control becomes more difficult due to smaller pitch requirements
Solution Approach 1:
The patent uses thermal expansion or contraction to dynamically adjust the pitch parameter of the carrier substrate. This allows precise control of pitch even at very small dimensions required for high-density arrangements, enabling increased micro-LED density while maintaining manufacturing precision through parameter adjustment rather than mechanical modification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise control of micro-LED pitch, reduces errors in high-density arrangements, and minimizes damage to micro-LEDs by stabilizing pressure and using a soft adhesive layer as a buffer, thereby improving the manufacturing process and display quality.
Implementation Method 1
controlling an air blowing device to provide an airflow into the accommodating portion of the feeding device from the inlet for driving the light-emitting elements to enter the grooves through the outlet
Implementation Method 2
the first heat conducting plate and a groove structure, the groove structure is combined with the first heat conducting plate
Data Source
AI summary
A display device includes a substrate, a plurality of electrical connection groups, a plurality of light-emitting elements, a light-transmitting plate, and an adhesive layer. The electrical connection groups may be formed in the substrate. The light-emitting elements may be disposed on the substrate. Each of the light-emitting elements may be electrically connected to the corresponding electrical connection group. The light-transmitting plate may cover the light-emitting elements. The adhesive layer may be formed between the light-transmitting plate and each of the light-emitting elements.