Driving Circuit Board Layout for Micro-LED Transfer Alignment
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Solution Overview
Problem
The challenge in manufacturing large-area display devices using micro-LEDs is the inefficient transfer process, which leads to increased time and cost due to the need for multiple transfer processes and alignment errors between pad electrodes and driving electrodes, resulting in degraded device performance.
Innovation Solution
A driving circuit board design with symmetrically arranged driving electrodes, including dummy electrodes that are not connected to the circuit, allows for efficient alignment and connection of pad electrodes on micro-LEDs, reducing alignment errors and improving transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional pick and place method is used to transfer micro-LEDs to driving circuit board, then transfer process can be completed, but productivity decreases as micro-LED size decreases and display device size increases
Solution Approach 1:
The driving circuit board is divided into multiple driving electrode regions with multiple driving electrodes arranged in matrix patterns. This segmentation allows parallel transfer of multiple micro-LEDs simultaneously, dramatically improving productivity and reducing transfer time compared to traditional sequential pick-and-place methods.
Solution Approach 2:
A transfer substrate with pad electrodes serves as an intermediary carrier. Micro-LEDs are first transferred to the transfer substrate in batches, then the entire substrate is transferred to the driving circuit board. This intermediary approach enables efficient batch transfer and reduces the number of transfer operations required.
2Area of stationary object
If multiple transfer processes are used to transfer micro-LEDs, then complete coverage can be achieved, but time and manufacturing cost increase
Solution Approach 1:
The large-area driving circuit board is segmented into multiple driving electrode regions, each capable of receiving micro-LEDs independently. This allows the entire board to be populated in a single transfer operation rather than requiring multiple sequential transfers, reducing manufacturing time while achieving complete coverage.
Solution Approach 2:
Multiple driving electrodes are arranged in matrix patterns across the driving circuit board, utilizing two-dimensional spatial distribution. This enables parallel reception of multiple micro-LEDs simultaneously, expanding the effective transfer area without increasing transfer time proportionally.
3Reliability
If alignment error occurs between pad electrodes and driving electrodes, then connection reliability degrades, but alignment precision is difficult to maintain
Solution Approach 1:
Multiple driving electrodes are pre-positioned in precise matrix patterns on the driving circuit board before micro-LED transfer. This preliminary positioning establishes accurate alignment references that guide the transfer process, ensuring reliable pad electrode to driving electrode connections while accommodating normal manufacturing tolerances.
Solution Approach 2:
The driving electrode structure includes asymmetric features such as different electrode shapes, sizes, or patterns that provide unique alignment identifiers. This asymmetry enables automatic alignment and verification during transfer, improving both alignment precision and connection reliability through built-in positional referencing.
Data Source
AI summary
A driving circuit board includes a driving circuit board includes: a plurality of driving electrode regions on a surface of the driving circuit board; a plurality of driving electrodes symmetrically arranged on the plurality of driving electrode regions; and a driving circuit electrically connected to at least one of the plurality of driving electrodes, wherein the plurality of driving electrodes include at least one dummy electrode that is not connected to the driving circuit.