Micro-LED Chip Transfer Alignment Using a Compensation Layer
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Solution Overview
Problem
The current micro-LED chip transfer process faces issues with abnormal binding between the LED chips and the driving substrate due to inclination and uneven pressure, leading to transfer failure and abnormal light emission.
Innovation Solution
The method involves a driving substrate with binding points, a compensation layer, and transfer electrodes, where pins on the chip substrate form grooves and via holes in the compensation layer to align and connect with the binding points, ensuring proper alignment and secure bonding of the LED chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional transfer process is used, then transfer speed is maintained, but transfer accuracy deteriorates due to chip inclination and uneven pressure
Solution Approach 1:
A compensation layer is introduced as an intermediary between the driving substrate and the chip substrate. This compensation layer includes grooves that accommodate chip inclination and transfer electrodes that compensate for uneven pressure, thereby improving transfer accuracy without requiring complex adjustment mechanisms. The compensation layer acts as a mediator that absorbs positioning errors and ensures reliable electrical connection.
2Strength
If pressure is increased to improve binding, then connection tightness improves, but chip inclination causes abnormal binding
Solution Approach 1:
The compensation layer is designed with localized grooves at specific binding positions that correspond to chip pins. These grooves provide localized compensation for chip inclination, ensuring that each binding position adapts to the chip's actual orientation. This local quality approach allows uniform pressure application while accommodating individual chip variations, preventing abnormal binding.
3Manufacturing precision
If alignment precision is improved, then transfer accuracy improves, but transfer process time increases
Solution Approach 1:
The compensation layer is pre-formed on the driving substrate before chip transfer, with grooves and transfer electrodes positioned in advance. This preliminary action eliminates the need for complex real-time alignment adjustments during the transfer process. The pre-configured compensation layer automatically accommodates positioning variations, maintaining high alignment precision while reducing process time.
Data Source
AI summary
A LED chip transfer method comprises: providing a driving substrate having at least one set of binding points, the set of binding points comprising a first and second binding points; forming a compensation layer covering the first and second binding points; providing a chip substrate comprising a substrate and chips; performing a first alignment treatment to form a first groove and a second groove on the compensation layer; forming a first and second via holes spaced from each other by the first groove and the second groove, forming a first transfer electrode and a second transfer electrode disconnected from each other on the compensation layer, inserting the first pin and the second groove into the first groove and the second groove to bind with the first transfer electrode and the second transfer electrode; and stripping the substrate from the chip.