Micro-LED Display Substrate Transfer for High Current Density
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Solution Overview
Problem
The manufacturing complexity and low current density issues associated with using light emitting diodes (LEDs) with small luminous areas in display apparatuses, which affect luminous efficacy and require increased current density, complicate the mounting and replacement processes.
Innovation Solution
A method of manufacturing a display apparatus that involves forming and transferring light emitting diode chips onto substrates with specific electrode configurations, using laser separation and elastic substrates to manage chip placement and increase current density, while maintaining efficient manufacturing yields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the luminous area of light emitting diodes is reduced to increase current density and improve luminous efficacy, then luminous efficacy is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the manufacturing process into distinct stages: forming LED chips on a first substrate, transferring them to a second substrate, and then to the final display substrate. This segmentation allows each stage to be optimized independently, managing the complexity of handling small-sized LEDs while maintaining high current density for improved luminous efficacy.
Solution Approach 2:
The patent introduces intermediate substrates (first and second substrates) as mediators in the manufacturing process. These intermediate substrates facilitate the handling and transfer of small LED chips, reducing the direct complexity of mounting tiny LEDs onto the final display substrate while preserving the high current density required for improved luminous efficacy.
2Loss of energy
If the luminous area of light emitting diodes is reduced to increase current density, then luminous efficacy is improved, but mounting and replacement complexity increases
Solution Approach 1:
The patent performs preliminary actions by pre-forming LED chips on a first substrate and pre-transferring them to a second substrate before final installation. This preliminary preparation simplifies the actual mounting and replacement processes, making it easier to handle and replace small LED chips while maintaining the high current density needed for improved luminous efficacy.
Solution Approach 2:
The manufacturing and repair process is segmented into multiple transfer stages, allowing LED chips to be prepared and organized on intermediate substrates before final installation. This segmentation makes mounting and replacement operations more manageable and less complex, while preserving the small luminous area design that enables high current density and improved luminous efficacy.
3Manufacturing precision
If multiple transfer steps are used to move light emitting diode chips through manufacturing stages, then manufacturing precision is improved, but manufacturing time increases
Solution Approach 1:
The patent combines multiple transfer operations into an integrated multi-stage process where LED chips are sequentially transferred from the first substrate to the second substrate and then to the final display substrate. By merging these operations into a coordinated sequence rather than separate independent steps, the system achieves high placement precision while minimizing total manufacturing time.
Solution Approach 2:
The patent performs preliminary transfer operations on intermediate substrates before final installation, preparing LED chips in advance with precise positioning. This preliminary action ensures that when chips are finally mounted on the display substrate, high precision is achieved without requiring excessive time during the critical final assembly stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the yield and efficiency of mounting and repairing LEDs with small luminous areas by increasing current density and simplifying the manufacturing and replacement processes, addressing the complexity and efficacy challenges in display apparatuses.
Implementation Method 1
irradiating the first manufacturing substrate with a laser to separate the plurality of light emitting diode chips from the first manufacturing substrate
Data Source
AI summary
A display apparatus including a substrate and having a first substrate electrode and a second substrate electrode, and light emitting sources disposed on the substrate and spaced apart from one another, the light emitting source including a light emitting structure having an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, a p-type electrode electrically connected to the p-type semiconductor layer, an n-type electrode electrically connected to the n-type semiconductor layer, in which the first substrate electrode extends from an upper surface of the substrate facing the light emitting sources to a lower surface thereof and is electrically connected to the p-type electrode, the first substrate electrode including an upper portion having a substantially flat top surface and disposed on the upper surface of the substrate and a lower portion disposed on the lower surface of the substrate.