Micro-LED Chip Transfer Tray With Magnetic Self-Alignment

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Solution Overview

Problem

The transfer of micro-LEDs for large-scale displays is challenging due to their small size and the difficulty in aligning and assembling millions of devices efficiently, with existing methods like pick and place having low success rates and self-assembly lacking comprehensive manufacturing technologies.

Innovation Solution

A chip tray system with a tray unit, chip alignment unit, and transfer unit that uses magnets and electric fields to align and transfer semiconductor light-emitting devices in a fluid, allowing for precise positioning and uniform distribution on a substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If self-assembly method is used for transferring micro-LEDs, then large-scale display manufacturing becomes feasible, but uniformity and reliability of device positioning deteriorates

Engineering Contradiction:
Improvelarge-scale display manufacturing capabilityVSAvoiddevice positioning uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent introduces a fluid medium as an intermediary between the micro-LEDs and the substrate. The fluid allows micro-LEDs to float and self-assemble while magnetic fields provide precise positioning control, resolving the contradiction between large-scale manufacturing capability and positioning uniformity.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces traditional mechanical transfer methods with a combination of fluid dynamics and magnetic field control. Micro-LEDs are transported through fluid flow and positioned using magnetic fields, enabling both high throughput and precise positioning without mechanical contact.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Productivity

If more micro-LEDs are supplied to increase assembly density, then productivity improves, but uniformity of supply across the substrate deteriorates

Engineering Contradiction:
Improveassembly densityVSAvoidsupply uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent uses dynamic control of fluid flow and magnetic field strength to regulate micro-LED supply. By adjusting flow rates and magnetic field gradients, the system maintains uniform distribution of micro-LEDs across the substrate while achieving high assembly density.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system incorporates feedback mechanisms to monitor micro-LED distribution and adjust fluid flow and magnetic field parameters in real-time, ensuring uniform supply across the entire substrate area while maintaining high productivity.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables high-yield, low-cost assembly of large-area displays by ensuring precise alignment and uniform distribution of micro-LEDs, reducing non-specific binding and facilitating easy loading and unloading of substrates.

Implementation Method 1

a chip alignment unit including a plurality of magnets

Methodology Applied
Scientific EffectMagnetic alignment: Magnetism

Implementation Method 2

a transfer unit configured to move the tray unit and the chip alignment unit, the transfer unit being characterized in that the transfer unit is configured to vertically move any one of the tray unit and the chip alignment unit with respect to the other one

Methodology Applied
Scientific EffectMechanical displacement: Displacement

Data Source

PatentUS12622093B2Chip transferring apparatus for self-assembly and method for supplying semiconductor light emitting diode
Publication Date: 2026.05.05 LG ELECTRONICS INC
  • US12622093B2 patent drawing
  • US12622093B2 patent drawing
  • US12622093B2 patent drawing

AI summary

A chip transferring apparatus for supplying a micro-LED provides a chip tray for carrying semiconductor light emitting diodes in a fluid received in an assembly chamber. The transferring apparatus includes a tray unit for receiving a plurality of semiconductor light emitting diodes, a chip alignment unit disposed on one side of the tray unit and having a plurality of magnets, and a transfer unit configured to move the tray unit and the chip alignment unit. The transfer unit can vertically move one of the tray unit and the chip alignment unit with respect to the other one thereof.