Micro-LED Transfer Substrate With Overlapping Recess Alignment
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Solution Overview
Problem
The productivity of micro-LED display apparatus manufacturing decreases as the size of micro-LEDs decreases and the size of displays increases, due to the inefficiencies of the pick and place method used in transferring micro-LEDs.
Innovation Solution
A device transfer substrate with recesses having specific overlapping regions and shapes is used to arrange light emitting devices, allowing for high transfer yield through fluidic or dry self-assembly methods, ensuring each device is positioned in one of two overlapping regions on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If pick and place method is used to transfer micro-LEDs, then individual device placement is achieved, but productivity decreases as micro-LED size decreases and display size increases
Solution Approach 1:
The substrate is divided into multiple recesses, each capable of receiving and positioning a micro-LED device. This segmentation allows parallel processing of multiple devices simultaneously, dramatically improving productivity compared to sequential pick-and-place methods while maintaining precise positioning capability for each individual device.
Solution Approach 2:
Multiple recesses are pre-formed on the substrate with specific geometries designed to automatically guide and position micro-LED devices during transfer. This preliminary structuring enables self-alignment and high-yield transfer without requiring precise real-time positioning operations, thereby enhancing manufacturing efficiency.
2Ease of manufacture
If traditional transfer methods are used, then manufacturing process is simple, but transfer yield is low
Solution Approach 1:
Each recess is designed with specific local geometric features (first region, second region, and overlapping region with controlled dimensions) that create favorable local conditions for device capture and positioning. The overlapping region's maximum width is specifically constrained to be less than the diameter or diagonal length of the device, ensuring high-positioning accuracy and transfer yield while maintaining overall process simplicity.
Data Source
AI summary
A device transfer substrate includes a plurality of recesses, wherein each of the plurality of recesses includes a first region having a shape of a first figure, a second region having a shape of a second figure, and an overlapping region formed as a portion of the first region partially overlaps a portion of the second region, wherein a maximum width of the overlapping region in a direction intersecting with a straight line passing through a center of the first figure and a center of the second figure is less than a diameter or a diagonal length of the first figure and less than a diameter or a diagonal length of the second figure.