Micro-LED Transfer Using Electric-Field Self-Assembly Spacing
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Solution Overview
Problem
Current methods for transferring semiconductor light emitting diodes to a wiring or assembly board for display devices face challenges in maintaining predetermined intervals and achieving high transfer efficiency, particularly for large-area displays.
Innovation Solution
A method involving the use of a temporary board with a sacrificial layer and an acceptor board, where semiconductor light emitting diodes are aligned and transferred using an electric field, ensuring they maintain their original intervals and minimizing movement distance, thereby improving process efficiency and reducing loss or damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly technology is used to transfer semiconductor light emitting diodes, then transfer efficiency is improved, but maintaining predetermined intervals becomes difficult
Solution Approach 1:
The patent applies preliminary action by pre-forming cells with predetermined intervals on the acceptor board before transferring the semiconductor light emitting diodes. The cells are created at specific positions and intervals in advance, which guides the self-assembly process to maintain the desired spacing. This preliminary structuring of the acceptor board ensures that even during automated self-assembly, the final arrangement maintains the required interval precision.
2Manufacturing precision
If pick & place technology is used to transfer semiconductor light emitting diodes, then interval precision is maintained, but transfer efficiency decreases
Solution Approach 1:
The patent merges the advantages of both self-assembly and precision positioning by combining cell-guided self-assembly with electric field control. The cells on the acceptor board provide the structural framework for precise interval maintenance, while the electric field mechanism enables automated, high-speed transfer of multiple diodes simultaneously. This hybrid approach achieves both high transfer efficiency and precise interval maintenance.
3Adaptability or versatility
If additional transfer process is used with assembly board, then flexibility in self-assembly structures is improved, but process complexity increases
Solution Approach 1:
The patent extracts the essential function of the assembly board by directly forming cells on the final acceptor board rather than using a separate intermediate assembly board. This eliminates the need for an additional transfer process while maintaining the flexibility of self-assembly structures. The cells are directly created on the acceptor board at predetermined intervals, allowing various self-assembly configurations without adding process steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise placement of semiconductor light emitting diodes on the acceptor board while maintaining their original intervals, enhancing transfer efficiency and reducing the risk of damage, thus facilitating the manufacturing of high-definition display devices.
Implementation Method 1
forming an electric field for moving the semiconductor light emitting diodes by applying power to at least one of the temporary board and the acceptor board
Data Source
AI summary
The present disclosure relates to a method for manufacturing a display device capable of transferring semiconductor light emitting diodes formed at predetermined intervals on a growth substrate to a wiring board or an assembly board while maintaining the intervals when the semiconductor light emitting diodes are transferred from the growth substrate to the assembly board by self-assembly.