Micro-LED Transfer Structure for Accurate Mass Placement
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Solution Overview
Problem
The bottleneck in manufacturing micro-LED display screens is the inefficiency in mass production due to displacement and inaccurate positioning of light emitting diodes during the selective mass transfer process, where traditional adhesive methods fail to maintain precise placement.
Innovation Solution
A supporting structure with at least two extending columns is etched between the substrate and light emitting diodes, using a photolithographic process and dry etching method, to firmly fix the diodes at a predetermined distance, preventing displacement during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If adhesive material is used to fix light emitting diodes on substrate, then light emitting diodes can be transferred, but light emitting diodes may displace and cannot be accurately disposed on set position
Solution Approach 1:
The supporting structure is divided into multiple supporting columns (at least two) that are distributed around the light emitting diode. This segmentation provides multiple fixed points that collectively prevent displacement in all directions, solving the positioning accuracy problem while maintaining mass production capability
Solution Approach 2:
The supporting structure is formed on the transfer substrate before the light emitting diode transfer process. This preliminary action creates pre-positioned fixation points that guide and constrain the light emitting diodes to their predetermined positions during transfer, ensuring both efficiency and precision
2Ease of operation
If traditional adhesive fixing method is used, then light emitting diodes can be transferred, but transfer accuracy is compromised due to displacement
Solution Approach 1:
The supporting structure acts as an intermediary between the transfer substrate and the light emitting diode. Instead of directly adhering the diode to the substrate (which causes displacement), the supporting columns provide a stable intermediate framework that maintains precise positioning during the transfer operation
Data Source
AI summary
The disclosure provides a manufacturing method of a mass transfer device. The manufacturing method includes the following. A transfer substrate coated with an adhesive layer is provided. A light emitting diode is transferred from an original substrate to the transfer substrate. A supporting structure is etched on the light emitting diode, where the supporting structure includes at least two supporting columns extending from the transfer substrate, and ends of the at least two supporting columns away from the transfer substrate are connected with the light emitting diode, so that the light emitting diode is arranged separately from the transfer substrate. The adhesive layer is removed, so that the light emitting diode is fixed on the transfer substrate only through the supporting structure. In addition, the disclosure also provides a mass transfer device and display equipment.