Micro-LED Electrode Structure for Uniform DEP Transfer and Contact
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Solution Overview
Problem
The self-assembly method using dielectrophoresis (DEP) for micro-LED displays faces challenges with low self-assembly rates due to non-uniform DEP force and decreased lighting rates caused by poor electrical contact characteristics between the electrodes of the self-assembly light emitting device and the panel electrodes.
Innovation Solution
A semiconductor light emitting device with a translucent electrode layer having a higher melting point than the lower electrode layer, treated with O2 or Ar plasma, and a thickness of 10 nm to 100 nm, is used, along with an adhesive metal layer and a magnetic layer, to improve DEP force uniformity and electrical contact, featuring a passivation layer and assembly wiring for precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If self-assembly method using dielectrophoresis is used to transfer micro-LEDs, then transfer speed is improved, but self-assembly rate decreases due to non-uniform DEP force
Solution Approach 1:
A translucent electrode layer is introduced as an intermediary between the light emitting part and the lower electrode layer. This intermediate layer serves as a dielectric medium that generates uniform dielectrophoresis force during self-assembly, enabling both rapid transfer and high self-assembly rates by mediating the interaction between the micro-LED and the electrode structure.
Solution Approach 2:
The patent modifies the electrical and structural parameters of the electrode system by adding a translucent electrode layer with specific dielectric properties. This parameter change creates a more uniform electric field distribution, which in turn generates uniform DEP force across the micro-LED array, simultaneously achieving fast transfer speed and high self-assembly rate.
2Productivity
If self-assembly method using dielectrophoresis is used, then transfer efficiency is improved, but lighting rate decreases due to poor electrical contact characteristics
Solution Approach 1:
The translucent electrode layer acts as a mediator that improves electrical contact characteristics. By providing a large contact area and uniform pressure distribution between the light emitting part and the lower electrode layer, this intermediate structure ensures reliable electrical connectivity, thereby maintaining high lighting rate while achieving efficient transfer.
Solution Approach 2:
The translucent electrode layer can be designed with porous or textured structure to increase the effective contact area between electrodes. This increased contact area improves electrical conductance and contact characteristics, ensuring reliable electrical connection for high lighting rate while maintaining the benefits of self-assembly transfer efficiency.
3Speed
If rapid transfer of millions of micro-LEDs is attempted, then transfer speed increases, but transfer error rate increases and transfer yield decreases
Solution Approach 1:
The translucent electrode layer creates a uniform potential distribution across the electrode structure, ensuring that dielectrophoresis force is evenly distributed. This equipotential condition enables all micro-LEDs to be transferred simultaneously with uniform positioning accuracy, achieving both high transfer speed and high transfer yield without increasing error rate.
Solution Approach 2:
By changing the electrical parameters of the electrode system through the addition of the translucent electrode layer, the patent achieves uniform electric field distribution. This parameter modification ensures consistent DEP force application across all micro-LEDs, enabling rapid transfer of millions of devices while maintaining high positioning precision and transfer yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the self-assembly rate and lighting efficiency by distributing the DEP force evenly and improving the surface morphology of the rear bonding metal, leading to stable and uniform electrical contact and increased assembly yield.
Implementation Method 1
a self-assembly transfer process using dielectrophoresis (DEP) is being attempted, but there is a problem with a low self-assembly rate due to the non-uniformity of the DEP force
Implementation Method 2
The translucent electrode layer may include a semiconductor light emitting device treated with O2 plasma or Ar plasma
Data Source
AI summary
A lens driving device according to an embodiment includes a substrate, a first frame including a lens and disposed on the substrate, a second frame on which the first frame is placed and a third frame on which the second frame is disposed. The first frame may move in a Z-axis direction, the second frame may tilt in X-axis and Y-axis directions and rotate around the Z axis, and the third frame may include a stopper structure to limit tilting and rotation of the second frame.