Wet Microchip Transfer Alignment With Chip Recovery for Micro-LEDs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The pick-and-place method for transferring micro-LEDs in display manufacturing is inefficient as the size of micro-LEDs decreases and display sizes increase, leading to decreased productivity.
Innovation Solution
A micro-semiconductor chip transfer apparatus that includes a wet alignment process using a chip supply module, alignment module, and extraction module, utilizing liquid spray, ultrasonic, and vibration cleaners to align and extract micro-semiconductor chips from a transfer substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick-and-place method is used for transferring micro-LEDs, then the transfer process can be performed with conventional equipment, but the productivity decreases as the size of micro-LEDs decreases and display size increases
Solution Approach 1:
The patent uses a liquid carrier to transport micro-LEDs to the transfer substrate. The liquid flow enables simultaneous transfer of multiple micro-LEDs in parallel, dramatically increasing transfer speed compared to conventional pick-and-place methods while maintaining alignment accuracy through the fluidic guidance of the liquid carrier
Solution Approach 2:
The patent transitions from mechanical pick-and-place operations in three-dimensional space to a two-dimensional liquid flow-based transfer method. The micro-LEDs are suspended and moved within the liquid plane, allowing parallel transfer across the entire substrate surface simultaneously rather than sequential transfer at discrete points
2Productivity
If micro-LEDs are transferred to a substrate, then the display device can be manufactured, but the micro-LEDs cannot be reused leading to material waste
Solution Approach 1:
The patent enables recovery and reuse of micro-LEDs through the liquid carrier system. Micro-LEDs that are misplaced or defective can be retrieved from the liquid carrier and reused in subsequent transfer cycles, significantly reducing material waste and improving chip utilization rate
Solution Approach 2:
The liquid carrier automatically collects and returns micro-LEDs to the source substrate after transfer attempts. The system self-manages the retrieval and repositioning of micro-LEDs without requiring additional manual intervention, enabling continuous reuse cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the alignment accuracy and productivity of micro-semiconductor chip transfer by enabling efficient reuse of chips through a wet alignment process, enhancing the efficiency of the transfer process.
Implementation Method 1
a chip alignment module comprising an absorber configured to move along a surface of the transfer substrate to align first micro-semiconductor chips, among the plurality of micro-semiconductor chips, respectively in the plurality of grooves and to absorb the first liquid
Implementation Method 2
a liquid spray cleaner configured to spray a second liquid to the absorber to extract the second micro-semiconductor chips from the absorber
Implementation Method 3
an ultrasonic cleaner configured to emit ultrasonic waves towards the absorber to extract the second micro-semiconductor chips from the absorber
Implementation Method 4
a vibration cleaner configured to vibrate the absorber to extract the second micro-semiconductor chips from the absorber
Data Source
AI summary
A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.