Micro-LED Display Assembly Wiring Layout to Prevent Fluid Short Circuits
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Solution Overview
Problem
The technical challenge in large micro-LED displays is the difficulty in quickly and accurately transferring millions of micro-LEDs to the display panel, and the issue of corrosion of assembly wiring in fluids during the transfer process, leading to electrical short circuits and assembly defects.
Innovation Solution
A display device design that includes a substrate with alternately arranged first and second assembly wirings, a planarization layer with openings for light emitting devices, and conductive connection members to electrically connect the assembly wirings and light emitting devices, minimizing parasitic capacitance and improving assembly efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer micro-LEDs in fluid, then assembly rate is improved, but assembly wiring is corroded by fluid causing electrical short circuits
Solution Approach 1:
The patent introduces a planarization layer as an intermediary between the assembly wiring and the fluid environment. This layer acts as a protective barrier that prevents fluid contact with the wiring while allowing the self-assembly process to proceed. The planarization layer with its openings enables the light emitting devices to be positioned correctly while protecting the underlying wiring from corrosion.
Solution Approach 2:
The patent extracts the wiring from direct exposure to the fluid environment by covering it with the planarization layer. Only specific portions of the wiring are exposed through openings to maintain electrical functionality, while the rest is protected from fluid contact that would cause corrosion and short circuits.
2Device complexity
If assembly wiring is placed on substrate without planarization layer, then structure is simplified, but parasitic capacitance increases and assembly precision decreases
Solution Approach 1:
The patent adds a vertical dimension to the wiring structure by stacking conductive layers at different heights on the planarization layer. This multi-layer approach allows wiring to be positioned in three-dimensional space, enabling precise alignment with openings while maintaining electrical connectivity and reducing parasitic capacitance through increased separation from the substrate.
3Reliability
If multiple conductive layers are used for assembly wiring, then parasitic capacitance is reduced, but manufacturing complexity increases
Solution Approach 1:
The planarization layer serves multiple functions simultaneously: it provides a planar surface for wiring placement, acts as a protective barrier against fluid corrosion, supports the multi-layer conductive structure, and defines the openings for device positioning. This multi-functionality reduces the need for additional separate components and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces parasitic capacitance, improves the assembly rate of light emitting devices, minimizes short circuit defects, and enhances the resistance of assembly wiring, while also simplifying the display device structure and improving light extraction efficiency.
Implementation Method 1
a light emitting device disposed in each of the plurality of openings
Data Source
AI summary
A display device according to an embodiment includes: a substrate; a plurality of assembly lines disposed on the substrate and including first assembly lines and second assembly lines which are alternately arranged; a planarization layer having a plurality of openings which overlap the plurality of assembly lines respectively; a plurality of light-emitting elements disposed in the plurality of openings respectively; and a plurality of conductive connection members disposed in the plurality of openings respectively to electrically connect the plurality of assembly lines and the plurality of light-emitting elements to each other, wherein the planarization layer protrudes more inwardly of the plurality of openings than one end of the respective assembly lines, and one end of the respective assembly lines is exposed from the planarization layer and comes into contact with the plurality of conductive connection members.