Micromirror Packaging with Low-Melting Seal and Integral Heater
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Solution Overview
Problem
Micromirror devices in display systems are sensitive to temperature and contamination, leading to mechanical failure and degradation during packaging, especially when heat is applied for sealing, which can alter mechanical properties and activate particles, causing diffusion and degradation.
Innovation Solution
A packaging method for micromirror devices that uses a sealing medium with a low melting temperature and an integral heater to control heat application, ensuring the temperature at the micromirror location remains below the threshold for mechanical failure, while using lubricants and getters to prevent stiction and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is applied for sealing the micromirror device package, then the sealing medium bonds the substrates together, but the heat degrades the micromirror array device by altering mechanical properties and activating particles
Solution Approach 1:
The patent changes the thermal parameters by using a sealing medium with low melting temperature (below 150°C) and applying heat locally through an integral heater, thereby achieving adequate bonding without subjecting the micromirror to harmful high temperatures that would degrade its mechanical properties
Solution Approach 2:
The sealing medium acts as an intermediary that bonds the substrates together while being processed at low temperatures. The integral heater serves as an intermediary heating mechanism that provides localized heat only where needed for sealing, protecting the micromirror from thermal damage
2Reliability
If heat is applied for sealing, then the sealing medium bonds the substrates, but particles are thermally activated and diffuse within the microstructures causing degradation
Solution Approach 1:
By changing the temperature parameter to remain below the threshold for particle activation and diffusion, the patent prevents thermal degradation of the micromirror structure while still achieving adequate sealing through the low-melting-point sealing medium
Solution Approach 2:
The integral heater provides localized heating as an intermediary mechanism that concentrates thermal energy only at the sealing interface, preventing bulk heating that would activate and diffuse particles within the micromirror structure
3Object-affected harmful factors
If micromirror devices are packaged after releasing, then contamination is prevented, but mechanical failure occurs due to sensitivity to temperature and contamination
Solution Approach 1:
The patent applies preliminary protective actions by incorporating anti-stiction materials and lubricants into the package structure before sealing, and by designing the sealing process to occur at low temperatures that do not degrade these protective materials or the micromirror itself
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents mechanical failure and degradation by controlling temperature and reducing contamination, ensuring the micromirror devices maintain their mechanical properties and operational efficiency.
Implementation Method 1
bonding the first and second substrates together by heating the sealing medium; ensuring the temperature at the micromirror location remains below the threshold for mechanical failure
Implementation Method 2
using lubricants and getters to prevent stiction and contamination
Implementation Method 3
using lubricants and getters to prevent stiction and contamination; reducing contamination
Data Source
AI summary
A method for making a micromirror device comprises is disclosed herein.