Micromirror Chip Packaging With Two-Stage Vibration Isolation
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Solution Overview
Problem
MEMS micromirror chips in vehicles are prone to damage due to excessive stress and vibration, particularly affecting the first torsion arm, which is not adequately addressed by existing technologies.
Innovation Solution
A micromirror chip package structure incorporating a vibration isolation platform and elastic beam, forming a two-degree-of-freedom system, with a gap and damping medium to absorb and attenuate vibration energy, reducing the amplitude of the movable component and preventing damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the MEMS micromirror chip is directly mounted on the vehicle body, then the structure is simple and easy to manufacture, but the micromirror chip is prone to damage due to excessive stress and vibration during vehicle driving
Solution Approach 1:
The patent introduces a vibration isolation platform as an intermediary component between the micromirror chip and the vehicle body. This platform includes an elastic beam that acts as a mediator to absorb and attenuate vibration energy, preventing direct transmission of harmful vibrations to the micromirror chip while maintaining a relatively simple overall structure
Solution Approach 2:
The patent implements beforehand cushioning by pre-installing the vibration isolation platform with elastic beams before the vehicle operates. This platform is designed to absorb and attenuate vibration energy in advance, creating a protective buffer that prevents excessive stress from reaching the micromirror chip during vehicle driving
2Manufacturing precision
If rigid mounting structure is used to fix the micromirror chip, then the positioning precision is high, but the vibration amplitude is large causing torsion arm breakage
Solution Approach 1:
The patent changes the mechanical parameters of the mounting structure by replacing rigid connections with elastic beams having specific stiffness characteristics. The elastic beam is designed with optimized dimensions and material properties to provide both positioning precision and vibration attenuation, allowing the system to maintain accuracy while reducing stress on the torsion arm
3Reliability
If vibration isolation measures are added to protect the micromirror chip, then the reliability is improved, but the device complexity increases
Solution Approach 1:
The patent merges the vibration isolation function with the mounting structure by integrating the elastic beam directly into the package substrate. This combination eliminates the need for separate vibration isolation components, achieving reliable vibration protection while maintaining a compact and relatively simple overall package structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure effectively reduces vibration amplitude and minimizes the risk of torsion arm damage, enhancing the micromirror chip's performance and reliability under vehicle vibrations.
Implementation Method 1
the elastic beam can further attenuate the vibration energy transferred to the movable component, thereby reducing a vibration amplitude of the movable component
Implementation Method 2
the vibration isolation platform is connected to the support frame through the elastic beam
Implementation Method 3
because there is the gap between the vibration isolation platform and the second substrate, the vibration isolation platform carrying the micromirror chip generates large squeeze-film damping in a movement process, to suppress a vibration amplitude of the vibration isolation platform
Data Source
Figure 1a~1b
Figure 2~3
Figure 4~5
AI summary
Embodiments of this application provide a micromirror chip package structure, a laser device, and a vehicle, relate to the field of micro-electro-mechanical technologies, and mainly used to provide a micromirror chip package structure that can suppress a vibration amplitude of a micromirror chip. The micromirror chip package structure includes a micromirror chip, and a first substrate and a second substrate that are stacked, where the micromirror chip is disposed on a side that is of the first substrate and that faces away from the second substrate, where the micromirror chip includes a frame, a movable component, and a first torsion arm, and the movable component is connected to the frame through the first torsion arm; the first substrate includes a vibration isolation platform, an elastic beam, and a support frame, the micromirror chip is disposed on the vibration isolation platform, and the vibration isolation platform is connected to the support frame through the elastic beam; the support frame is fastened to the second substrate, and a gap is formed between the vibration isolation platform and the second substrate; and the vibration isolation platform and the second substrate each have a hollow area, and the hollow area is opposite to the movable component. The micromirror chip package structure is a two-degree-of-freedom system for vibration isolation, thereby improving performance of the micromirror chip.