Micromirror Pivot Apparatus Flexural Spring Thermal Dissipation
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Solution Overview
Problem
Micromirrors face challenges in reliable heat dissipation and robust construction, especially as light intensity increases, leading to thermal overload.
Innovation Solution
A pivot apparatus for micromirrors utilizing flexural springs with a large width-to-thickness ratio, providing robustness and effective thermal coupling, and optionally made of monocrystalline silicon, allowing for efficient heat dissipation and robust construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional torsion springs are used for micromirror support, then the construction is simple, but thermal dissipation is insufficient and robustness is reduced
Solution Approach 1:
The patent changes the geometric parameters of the spring elements by using flexural springs with a large width-to-thickness ratio (width at least three times, five times, or more than ten times the thickness). This parameter change enables the spring to provide both robust mechanical support and sufficient thermal conduction path for heat dissipation from the micromirror.
Solution Approach 2:
The patent employs flexural springs made of monocrystalline silicon, which combines mechanical elasticity with superior thermal conductivity. This material choice creates a composite functionality where the spring element simultaneously provides mechanical support, thermal conduction, and robust construction without requiring separate components.
2Temperature
If spring elements with small cross section are used, then device complexity is reduced, but thermal coupling and heat dissipation are insufficient
Solution Approach 1:
The patent fundamentally changes the cross-sectional parameters of the spring elements by adopting a flexural spring design where the width is at least three times, five times, or more than ten times the thickness. This creates a large cross-sectional area that provides both robust mechanical strength and adequate thermal conduction area for effective heat dissipation.
3Illumination intensity
If light intensity is increased for better illumination, then illumination intensity improves, but thermal load on micromirror increases causing thermal overload
Solution Approach 1:
The patent converts the harmful thermal effect of high-intensity light into a manageable parameter by designing the flexural spring support structure to actively conduct heat away from the micromirror. The spring elements serve dual purposes: providing mechanical support and acting as thermal conduction paths that lead heat away from the mirror, thus enabling high illumination intensity without thermal overload.
4Strength
If robust construction is prioritized with large cross section springs, then robustness improves, but device complexity increases
Solution Approach 1:
The patent makes the spring elements universal by designing them to simultaneously fulfill multiple functions: mechanical support, thermal conduction, and robust structural stability. The flexural spring with large width-to-thickness ratio acts as a multi-functional component that eliminates the need for separate thermal management and structural support elements, thereby reducing overall device complexity despite the robust construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pivot apparatus achieves enhanced thermal dissipation and robustness, enabling reliable operation under increased light intensity, suitable for various applications including EUV lithography.
Implementation Method 1
Good thermal coupling between the two ends of the flexural springs can thus also be achieved by way of such flexural springs. This enables good heat discharge from a component, for example a micromirror, coupled to the flexural spring.
Data Source
AI summary
A pivot apparatus, in particular a pivot apparatus for a micromirror, a fixed base frame being connected, directly or indirectly via an intermediate frame, to a pivotable carrier element. Spring elements having flexural springs are respectively disposed between the base frame and carrier element, base frame and intermediate frame, and intermediate frame and carrier element. The use of flexural springs enables good thermal coupling between the individual components, and an increase in robustness. The pivot apparatus can be embodied in particular as a microelectromechanical system.