Monolithic Micromirror and TMOS Detector Layout for Precise 3D Sensing
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Solution Overview
Problem
Existing systems for 3D reconstruction using near-infrared radiation suffer from low precision and accuracy due to the separation of components, making it difficult to effectively orient and detect radiation in medical examinations.
Innovation Solution
An integrated component is manufactured by integrating a thermal MOS transistor and a micromirror within the same semiconductor wafer, using a capacitive-driving assembly and air-tight chambers to enhance precision and accuracy of radiation detection and orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are physically separated in existing systems, then manufacturing and assembly are simplified, but system dimensions increase and synergistic operation becomes difficult
Solution Approach 1:
The patent integrates the micromirror device and TMOS transistor detector into a single monolithic component fabricated on one semiconductor wafer. The micromirror structure (including mobile mass, stator, and rotor) and the detector are formed simultaneously using the same semiconductor processing steps, eliminating the need for separate assembly and enabling direct synergistic operation between the radiation-deflecting micromirror and the radiation-detecting TMOS transistor.
2Measurement precision
If a monolithic integrated component is manufactured, then synergistic operation and precision are improved, but manufacturing complexity increases
Solution Approach 1:
The patent employs a universal semiconductor manufacturing process that simultaneously creates multiple functional elements: the micromirror mobile mass, the capacitive actuation structure (stator and rotor), the TMOS transistor detector, and the interconnecting structural layers. This multi-functional approach allows a single fabrication sequence to produce all components needed for precise radiation detection and orientation, avoiding the need for separate specialized manufacturing steps.
3Adaptability or versatility
If component separation is used, then system flexibility is maintained, but radiation orientation precision and detection accuracy decrease
Solution Approach 1:
The patent segments the integrated component into distinct functional regions: the micromirror actuation region with stator and rotor, the mobile mass region for radiation deflection, and the TMOS transistor detector region. These segmented regions are formed through selective etching and deposition steps that create spatially separated but electrically and optically coupled functional zones, maintaining design flexibility while achieving precise synergistic operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated component reduces system size, improves precision in radiation orientation and detection, and enables faster and more accurate medical diagnoses, facilitating the identification of disorders like rheumatoid arthritis and osteoarthritis.
Implementation Method 1
actuation of a capacitive type is made possible via electric currents that are supplied to a stator and to a rotor of the micromirror. Such electric currents generate a difference of capacitance across the mobile mass of the micromirror so that said mass, subjected to a twisting moment, can be controlled
Implementation Method 2
the micromirror is obtained by depositing a metal, such as gold or aluminum, on a mobile mass of a die, in order to create a reflecting surface (e.g., so as to achieve a reflectivity higher than 98%)
Implementation Method 3
The radiation emitted, received by the TMOS transistor, causes generation of charge carriers at the conductive channel of the TMOS transistor and, hence, a variation of the output current
Data Source
AI summary
Disclosed herein is an integrated component formed by a first wafer having first and second trenches defined in a top surface thereof, and a second wafer coupled to the first wafer and formed by a substrate with a structural layer thereon that integrated an electromagnetic radiation detector overlying the second trench. A first cap is coupled to the second wafer, overlies the electromagnetic radiation detector, and serves to define a first air-tight chamber in which the electromagnetic radiation detector is positioned. A stator, a rotor, and a mobile mass are integrated within the substrate and form a drive assembly for driving the mobile mass. The rotor overlies the first trench. A second cap is coupled to the second wafer, overlies the mobile mass, and serving to define a second air-tight chamber in which the mobile mass is positioned.