Microneedle Electrodeposition via Equipotential Array Positioning

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Solution Overview

Problem

The fabrication of microneedles for use in electrochemical sensors is not homogeneous, particularly when manufacturing a large number of microneedles, which affects their performance in detecting body analytes like glucose.

Innovation Solution

A method involving an array of raw microneedles positioned equidistant from a conductive element, immersed in a solution with an active element, and subjected to a potential or current to form a uniform and homogeneous film through electrodeposition, allowing for either metallization or functionalization of the microneedles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional electrodeposition methods are used to deposit active elements on microneedles, then the deposition process can be performed, but the resulting film is not uniform and homogenous across large numbers of microneedles

Engineering Contradiction:
Improveuniformity of active element depositVSAvoidnumber of microneedles manufactured
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies equipotentiality by positioning all microneedle tips at the same distance from the conductive element, ensuring they are at equipotential during electrodeposition. This uniform positioning creates consistent electric field distribution across all microneedles, resulting in uniform and homogenous active element deposition even when manufacturing large numbers of microneedles simultaneously.

Inventive Principle:
Principle #12Equipotentiality

2Productivity

If electrodeposition is performed on arrays of microneedles, then productivity increases, but manufacturing precision decreases due to non-uniform deposits

Engineering Contradiction:
Improvenumber of microneedles manufacturedVSAvoiduniformity of active element deposit
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent resolves this contradiction by establishing equipotential conditions for all microneedles in the array through uniform positioning relative to the conductive element. This allows simultaneous electrodeposition on multiple microneedles (high productivity) while maintaining uniform active element distribution across all tips (high manufacturing precision).

Inventive Principle:
Principle #12Equipotentiality

Solution Approach 2:

The patent introduces a spatial dimension control by positioning microneedles at a specific distance range (0.1mm to 10mm) from the conductive element. This dimensional parameter ensures uniform electric field exposure across the array, enabling both high throughput and consistent deposition quality.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If microneedles are positioned close to the conductive element for better deposition control, then manufacturing precision improves, but the risk of contact and short-circuiting increases

Engineering Contradiction:
Improvequality of active element depositVSAvoidrisk of short-circuiting
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent maintains a safe distance (0.1mm to 10mm) between microneedles and the conductive element while still achieving equipotential conditions for effective electrodeposition. This distance prevents short-circuiting and contact hazards while ensuring uniform electric field distribution for high-quality active element deposition on all microneedle tips.

Inventive Principle:
Principle #12Equipotentiality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a homogenous deposit of conductive or enzyme layers on microneedles, enhancing their performance as electrodes in electrochemical sensors and facilitating scalable manufacturing.

Implementation Method 1

applying a potential or a current between the conductive element, forming a cathode, and at least one raw microneedle of the array of raw microneedles forming an anode, causing an electrodeposition of a uniform and homogenous film comprising the active element on the raw microneedles of the anode

Methodology Applied
Scientific EffectElectrodeposition: Electrodeposition

Data Source

PatentEP4374775A1Open flow cell process and system for fabricating microneedles
Publication Date: 2024.05.29 WIZP AS
  • EP4374775A1 patent drawingFigure 1~2
  • EP4374775A1 patent drawingFigure 3
  • EP4374775A1 patent drawingFigure 4A~4B

AI summary

The invention relates to a method comprising the steps of: a) disposing an array (10) of raw microneedles (11) in front of a conductive element (12) so that the conductive element (12) is at equidistance of every raw microneedle (11) and not in contact with the tips of the raw microneedles (11); b) immersing the array (10) of raw microneedle(s) (11) and the conductive element (12) in a solution (13) comprising an active element (14), c) applying a potential (V) or a current (I) between the conductive element (12), forming a cathode, and at least one raw microneedle (11) of the array (10) of raw microneedles (11) forming an anode, causing an electrodeposition of a uniform and homogenous film comprising the active element (14) on the raw microneedles (11) of the anode.