Micropattern Development Using Gas-Phase Surface Tension Reduction
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Solution Overview
Problem
Micropattern formation using supercritical fluids often results in particle defects and a high risk of pattern collapse due to surface tension issues during the development process.
Innovation Solution
A substrate processing method involving the use of a surface tension reducing agent as a gas to reduce developer surface tension, allowing for bulk flow removal of the developer from the substrate without embossing, thereby minimizing particle defects and collapse risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If supercritical fluids are used during micropattern forming, then the risk of pattern collapse is reduced, but particle defects occur
Solution Approach 1:
The patent changes the physical state parameter of the processing fluid from supercritical (high pressure) to gaseous (atmospheric pressure) state. This parameter change maintains the low surface tension benefit that prevents pattern collapse while eliminating the particle defect problem associated with supercritical fluid handling and phase transition
Solution Approach 2:
The patent converts the typically harmful high surface tension of liquids into a beneficial low surface tension state by using gaseous surface tension reducing agents. This allows the surface tension property, which normally causes pattern collapse, to become beneficial for pattern formation while avoiding particle defects through the gaseous state
2Object-generated harmful factors
If conventional liquid developers are used, then particle defects may occur, but pattern collapse risk increases due to surface tension
Solution Approach 1:
The patent applies pneumatic principles by using gaseous surface tension reducing agents instead of liquid developers. The gas phase allows for effective surface tension reduction without the particle contamination issues inherent in liquid handling, thereby preventing pattern collapse while avoiding particle defects
Solution Approach 2:
The patent changes the phase parameter from liquid to gas for the surface tension reducing agent. This parameter change eliminates the particle defect problem associated with liquid handling while maintaining the low surface tension effect needed to prevent pattern collapse during micropattern formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively forms a smooth micropattern surface with reduced particle defects and lower risk of collapse by controlling surface tension, ensuring precise pattern formation without embossing.
Implementation Method 1
providing a surface tension reducing agent as a gas onto a substrate, the substrate having an exposed photoresist layer and a layer of developer on the exposed photoresist layer
Implementation Method 2
causing bulk flow of the developer to remove the developer from the substrate
Data Source
AI summary
A substrate processing method includes providing a surface tension reducing agent as a gas onto a substrate, the substrate having an exposed photoresist layer and layer of developer on the exposed photoresist layer, and causing a bulk flow of the developer in order to remove the developer from the substrate.