Microperforated Set-Top Box Casing for Passive Thermal Management

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Solution Overview

Problem

Set-top boxes face challenges with liquid and insect entry due to venting apertures for heat dissipation, which also increase noise and size, conflicting with consumer preferences for smaller, quieter, and more robust devices.

Innovation Solution

An electronic device design featuring a micro-perforated outer casing with a heatsink and louvered heatsinking element for heat dissipation without fans, combined with a locking mechanism for end caps and a disengagement tool for maintenance, utilizing surface tension to prevent liquid and insect entry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If venting apertures are used for heat dissipation, then heat removal is improved, but liquid and insect entry increases

Engineering Contradiction:
Improveheat dissipationVSAvoidliquid and insect entry
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The outer casing incorporates microperforations with diameters of 0.5-1.0 mm that function as a porous barrier. These small openings allow heat to escape through convection and conduction while the cumulative surface area and surface tension effects prevent liquid penetration and block insect entry, resolving the contradiction between heat dissipation and protection from harmful factors.

Inventive Principle:
Principle #31Porous materials

Solution Approach 2:

The invention changes the parameter of aperture size from conventional large vents to microperforations of 0.5-1.0 mm diameter. This parameter change fundamentally alters the function of the openings: they remain effective for heat dissipation due to their cumulative surface area and airflow characteristics, but become ineffective for liquid and insect penetration, thus resolving the technical contradiction.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If heat dissipation fans are used, then electrical robustness is improved, but noise and device size increase

Engineering Contradiction:
Improveelectrical robustnessVSAvoiddevice size and noise
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The invention extracts and eliminates the fan component from the heat dissipation system. By using passive microperforations combined with heatsink structures, the active fan mechanism is removed entirely, reducing device complexity, eliminating noise generation, and decreasing overall device size while maintaining heat dissipation effectiveness and electrical robustness.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The heat dissipation system operates autonomously without requiring active fan control. The microperforated casing works in conjunction with passive heatsink structures to create natural convection currents that dissipate heat automatically based on temperature differentials, providing self-regulating thermal management that improves reliability without adding mechanical complexity.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat while preventing liquid and insect ingress, maintaining device robustness and aesthetic appeal, and allowing vertical orientation for enhanced heat escape, meeting consumer preferences without the need for fans.

Implementation Method 1

the outer casing has heat venting perforations on any of its sides

Methodology Applied
Scientific EffectHeat dissipation: Convection

Implementation Method 2

utilizing surface tension to prevent liquid and insect entry

Methodology Applied
Scientific EffectSurface tension: Surface Tension

Implementation Method 3

a heatsink surrounded by a peripheral area... the heatsink can be raised with respect to the peripheral area... a heatsinking element can be over the interior electronic component. The heatsinking element can have a central region in thermal contact with the heatsink

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

providing a base stand that permits the device stand vertically such that that the top and the bottom of the outer casing are oriented vertically

Methodology Applied
Scientific EffectGravitational convection: Gravitational Convection (non heat)

Data Source

PatentUS8902588B2Set-top box having microperforations
Publication Date: 2014.12.02 INTERDIGITAL CE PATENT HOLDINGS SAS
  • US8902588B2 patent drawing
  • US8902588B2 patent drawing
  • US8902588B2 patent drawing

AI summary

The set-top box includes an outer casing having micro-perforations, an interior bottom frame having a centrally located heatsink, a circuit board on the bottom frame and a louvered heatsinking element over the circuit board and in thermal contact with the heatsink.