Microphone Back Plate Non-Uniform Hole Pattern Optimization

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Solution Overview

Problem

Conventional microphones face limitations in reducing noise from the back plate, which restricts the improvement of sound quality due to the limitations in increasing the perforation ratio without compromising the robustness and effective capacitance area.

Innovation Solution

The use of a combined pitch value to identify specific patterns of holes on the back plate, reducing air resistance and noise by computing damping and capacitance parameters at varying pitches, and determining optimal hole patterns based on these parameters.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-generated harmful factors

If the perforation ratio of the back plate is increased to reduce noise, then the noise level decreases, but the robustness and effective capacitance area of the back plate deteriorate

Engineering Contradiction:
Improvenoise from back plateVSAvoidrobustness and effective capacitance area
Core Design Contradiction:
Object-generated harmful factorsVSStrength

Solution Approach 1:

The patent applies local quality by creating non-uniform hole patterns where different regions of the back plate have different hole densities and sizes. Specifically, the electrode area has a different hole pattern compared to non-electrode areas, allowing noise reduction in critical regions while preserving structural integrity and capacitance in other regions. This localized optimization resolves the contradiction by making the back plate properties spatially variable rather than uniform.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs parameter changes by systematically varying hole pitch, hole size, and hole density across different regions of the back plate. By computing optimal pitch values based on gap distances and adjusting these parameters in different areas, the solution achieves noise reduction without uniformly compromising the back plate's robustness and capacitance properties.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If a uniform hole pattern is used on the back plate, then manufacturing is simplified, but noise reduction effectiveness is limited

Engineering Contradiction:
Improvehole pattern fabricationVSAvoidnoise from back plate
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The patent transitions from uniform to non-uniform hole patterns where specific regions (electrode areas vs. non-electrode areas) have optimized hole configurations. This local differentiation improves noise reduction effectiveness while maintaining manufacturing feasibility through systematic design rules for each region type.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The back plate is segmented into distinct functional regions (electrode areas and non-electrode areas) with different hole patterns. This segmentation allows each region to be optimized independently for its specific function, improving overall noise reduction while maintaining clear manufacturing guidelines for each segment.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively reduces noise from the back plate, enhancing the signal-to-noise ratio and improving sound quality beyond the limitations of conventional methods.

Implementation Method 1

a back plate and a diaphragm... receive an acoustic signal from the acoustic transducer

Methodology Applied
Scientific EffectAcoustic transduction:

Implementation Method 2

reducing air resistance and noise by computing damping and capacitance parameters at varying pitches

Methodology Applied
Scientific EffectAir flow through perforations:

Data Source

PatentUS11228845B2Systems and methods for acoustic hole optimization
Publication Date: 2022.01.18 KNOWLES ELECTRONICS LLC
  • US11228845B2 patent drawing
  • US11228845B2 patent drawing
  • US11228845B2 patent drawing

AI summary

A microphone assembly includes an acoustic transducer having a back plate and a diaphragm, such that a surface of the back plate includes a plurality of holes. At least a portion of the plurality of holes are arranged in a non-uniform pattern. The non-uniform pattern includes holes of varying sizes spaced apart from neighboring holes by varying distances. The microphone assembly further includes an audio signal electrical circuit configured to receive an acoustic signal from the acoustic transducer.