Microphone Carrier Element Aperture Mounting
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Solution Overview
Problem
Existing mobile terminal assemblies face acoustical impedance issues due to sound propagation through apertures in printed circuit boards and microphone packages, leading to attenuated sound quality and electromagnetic interference.
Innovation Solution
A portable communication device assembly with a microphone positioned partly within an aperture in the printed circuit board, utilizing a carrier element with acoustical and electromagnetic shielding to optimize sound propagation and reduce electromagnetic interference, featuring a Chip-Scale-Packaged (CSP) MEMS microphone assembly with a semiconductor substrate and electronic circuit die for signal processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the microphone is mounted on the printed circuit board with sound propagation through apertures, then the microphone can be integrated into the device structure, but acoustical impedance and sound attenuation occur
Solution Approach 1:
The patent extracts the microphone from the traditional PCB mounting location and positions it directly at the sound inlet aperture. This separation of the microphone from the PCB's internal cavity eliminates the acoustic impedance issues caused by sound propagation through multiple apertures and PCB layers, while maintaining easy integration through direct mounting at the aperture location
Solution Approach 2:
The patent introduces an acoustic seal as an intermediary element between the PCB and the microphone housing. This acoustic seal creates an acoustic pathway that directs sound directly from the sound inlet to the microphone diaphragm, eliminating the need for sound to propagate through multiple apertures and reducing acoustic impedance while maintaining structural integration
2Device complexity
If the microphone is positioned away from the sound inlet, then the device structure is simplified, but sound attenuation and electromagnetic interference increase
Solution Approach 1:
The patent merges the microphone positioning with the sound inlet location, placing the microphone diaphragm in direct proximity to the aperture. This combination eliminates the need for separate acoustic pathways and reduces the distance sound must travel, thereby minimizing sound attenuation and electromagnetic interference while maintaining structural simplicity
Solution Approach 2:
The patent applies local quality by creating a specialized acoustic seal at the specific location where the microphone meets the PCB. This localized acoustic sealing solution addresses the harmful effects of sound attenuation and electromagnetic interference at the critical interface between the microphone and the device structure, without requiring complex modifications to the overall device design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances acoustical performance by minimizing sound attenuation and electromagnetic interference, ensuring undistorted sound propagation within the audio frequency band and providing effective shielding, thus improving the overall performance of the microphone assembly.
Implementation Method 1
an acoustical seal provided between the first printed circuit board and the carrier element for acoustically sealing the second opening or cavity
Implementation Method 2
an electromagnetic shield provided between the first printed circuit board and the carrier element for electromagnetically shielding the microphone from the surroundings
Data Source
AI summary
A portable communication device assembly comprising a housing and a PCB provided therein. A microphone is provided at least partly within an aperture in the PCB, which aperture is positioned adjacent to a sound input of the housing. The microphone may be attached to a carrier element also attached to the PCB, and additional electronic components may be attached to the carrier element. Acoustic and/or electromagnetic shielding may be provided.