Microphone Damping Structure for Resonance Isolation
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Solution Overview
Problem
Existing voice interaction apparatuses suffer from sound pickup resonance due to direct hardware connections, affecting microphone accuracy and recognition, which conventional damping structures fail to mitigate effectively.
Innovation Solution
A sound pickup device damping structure is designed with a housing, circuit board, and damping layers to enclose a sound pickup component, reducing mechanical vibrations and incorporating a sealing piece to enhance sound propagation while minimizing resonance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the microphone is directly connected to the apparatus structure through hardware connection, then the device complexity is reduced, but sound pickup resonance occurs affecting accuracy
Solution Approach 1:
A damping layer is introduced as an intermediary component between the microphone and the apparatus housing. This damping layer serves as a mediator that isolates the microphone from mechanical vibrations of the housing while still allowing acoustic signals to pass through, thereby resolving the contradiction between simple connection structure and accurate sound pickup
Solution Approach 2:
The damping layer is implemented as a flexible thin film structure that selectively transmits acoustic waves while blocking mechanical vibrations. This flexible film approach allows the microphone to be connected to the housing structure without direct mechanical contact, maintaining structural simplicity while improving measurement precision
2Reliability
If a damping layer is added between the housing and sound pickup component, then vibration impact is reduced, but the device complexity increases
Solution Approach 1:
The damping layer is designed as a thin flexible film rather than a bulky damping structure. This thin film approach provides effective vibration isolation while minimizing the increase in device complexity and maintaining a compact form factor
Solution Approach 2:
The damping layer utilizes porous material structure that allows acoustic waves to pass through while absorbing mechanical vibrations. The porous structure provides effective damping performance with minimal material thickness, thus reducing the impact on device complexity
3Object-affected harmful factors
If the damping layer completely isolates the sound pickup component from the housing, then vibration resistance is improved, but sound propagation is blocked
Solution Approach 1:
The damping layer is constructed with porous material that allows acoustic waves to pass through while absorbing mechanical vibrations. The porous structure creates acoustic pathways that maintain sound propagation efficiency while providing effective vibration isolation, thus resolving the contradiction between vibration resistance and sound pickup accuracy
Solution Approach 2:
The flexible thin film structure of the damping layer is designed with specific acoustic transmission properties that allow sound waves to pass through while blocking mechanical vibrations. This selective transmission characteristic resolves the contradiction by maintaining sound propagation while providing vibration resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the impact of apparatus vibrations on sound pickup accuracy and recognition, improving user experience by isolating the microphone from external mechanical influences and ensuring efficient sound propagation.
Implementation Method 1
a first damping layer, disposed between the side wall and the sound pickup component
Implementation Method 2
reducing mechanical vibrations and incorporating a sealing piece to enhance sound propagation while minimizing resonance
Implementation Method 3
a second sound pickup hole in the side wall, a hole channel in the first damping layer and a first sound pickup hole disposed in the sound pickup component are communicated with each other
Implementation Method 4
at least one sealing piece, disposed between the first damping layer and the sound pickup component and configured for covering the sound pickup component; wherein a hole channel of the sealing piece is communicated with the hole channel in the first damping layer and the first sound pickup hole disposed in the sound pickup component
Data Source
AI summary
A sound pickup device damping structure and a sound pickup apparatus, the sound pickup device damping structure includes: a housing, including a side wall and a peripheral wall connected with the side wall; a circuit board, fixedly connected with the peripheral wall, wherein the circuit board and the side wall and the peripheral wall enclose to form an accommodating chamber; at least one sound pickup component, located in the accommodating chamber and electrically connected with the circuit board; and a first damping layer, disposed between the side wall and the sound pickup component; wherein a second sound pickup hole in the side wall, a hole channel in the first damping layer and a first sound pickup hole disposed in the sound pickup component are communicated with each other.