Microphone Sound Delay Filter Elastic Mounting
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Solution Overview
Problem
The existing manufacturing processes for MEMS microphones are complex and prone to defects due to the use of adhesives for mounting sound delay filters, leading to performance deterioration and increased failure rates, especially during high-temperature soldering processes.
Innovation Solution
The sound delay filter is elastically accommodated within a filter accommodation portion of the microphone cover, eliminating the need for adhesives and preventing damage from external impacts and high-temperature exposure, using a polymer material with integrated elastic patterns for secure alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sound delay filter is mounted on the inner surface of the cover using an adhesive, then the filter can be fixed in position, but the manufacturing process becomes complicated and the filter hole may be blocked by adhesive leading to performance deterioration
Solution Approach 1:
The patent removes the adhesive mounting process entirely by integrating the sound delay filter into the cover structure. The filter is positioned within a dedicated filter accommodation portion of the cover, eliminating the need for separate adhesive application and curing steps, thus simplifying the manufacturing process while preventing adhesive-related performance degradation
Solution Approach 2:
The sound delay filter and cover are combined into a single integrated component. The filter accommodation portion is formed as part of the cover structure itself, merging two previously separate elements (cover and filter mounting mechanism) into one unified component, thereby reducing manufacturing steps and eliminating adhesive usage
2Reliability
If the sound delay filter is mounted using adhesive, then the filter can be secured to the cover, but the high-temperature heat during MEMS microphone mounting damages and deforms the filter
Solution Approach 1:
The patent removes the adhesive layer that would be damaged by high-temperature soldering. By eliminating the adhesive mounting method entirely and using mechanical integration instead, the filter is no longer dependent on adhesive bonds that would fail under the 200°C heat of the SMT process, thus protecting filter durability during manufacturing
Solution Approach 2:
The filter accommodation portion is pre-formed in the cover structure before the soldering process. The filter is positioned and secured mechanically in advance, so when high-temperature soldering occurs, the filter is already protected by the rigid cover structure rather than relying on temperature-sensitive adhesive bonds
3Ease of manufacture
If the sound delay filter protrudes from the outer surface of the cover, then the filter is accessible for mounting, but the filter is easily damaged and separated by external impact and interference
Solution Approach 1:
The sound delay filter is nested inside the cover structure within the filter accommodation portion. This nested configuration protects the filter from external impacts and interference while maintaining proper acoustic alignment through the cover's sound hole, eliminating the need for the filter to protrude externally
4Object-affected harmful factors
If the sound delay filter is mounted inside the cover, then the filter is protected from external damage, but the mounting process becomes complicated requiring adhesive application
Solution Approach 1:
The cover and filter mounting structure are merged into a single integrated component. The filter accommodation portion is formed as an integral part of the cover, eliminating the need for separate adhesive application steps while maintaining the protective enclosure that shields the filter from external damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, enhances the microphone's stability and reliability, reduces production costs, and increases yield by avoiding adhesive-related defects and high-temperature damage.
Implementation Method 1
an elastic pattern integrally formed with at least one end portion of the filter substrate, the elastic pattern being elastically disposed between the inner wall of the filter accommodation portion and the filter substrate
Data Source
AI summary
A microphone includes a substrate having a first sound hole formed therein, a sound-sensing module mounted on the substrate so as to be aligned with the first sound hole, a signal-processing chip mounted on the substrate so as to be electrically connected to the sound-sensing module, a cover mounted on the substrate so as to accommodate the sound-sensing module therein and including a filter accommodation portion having a second sound hole formed therein, and a sound delay filter elastically accommodated in the filter accommodation portion so as to be aligned with the second sound hole. The microphone has a simplified structure, and can be manufactured to as to improve the stability and reliability thereof.