Microphone Package Lateral Solder Pads for Directional Sound Reception
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Solution Overview
Problem
Conventional microphone package structures are limited in receiving sound signals as they can only receive sound from above due to solder pads being positioned on the bottom side of the substrate, restricting their directional capability.
Innovation Solution
The microphone package structure features solder pads on the lateral and bottom sides of the substrate, allowing for flexible positioning on external circuit boards, enabling sound signal reception from above or laterally by positioning the substrate accordingly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If solder pads are positioned on the bottom side of the substrate, then the microphone package structure can be easily mounted on PCB substrate using surface mount technology, but it can only receive sound signals from above and not laterally
Solution Approach 1:
The solder pads are segmented into two distinct groups: first solder pads positioned on the bottom side of the substrate and second solder pads positioned on the lateral side. This segmentation allows the microphone package to be mounted in different orientations depending on which solder pad group is used, thereby enabling flexible sound signal reception directions while maintaining ease of manufacture through standard surface mount technology
Solution Approach 2:
The microphone package structure is designed with dual mounting capabilities by providing both bottom-side solder pads and lateral-side solder pads. This multi-functionality allows the same package to serve different application needs: mounting on its side for lateral sound reception or mounting flat for top sound reception, thus achieving versatility without compromising manufacturing ease
2Ease of manufacture
If solder pads are positioned only on the bottom side of the substrate, then the manufacturing process is simplified, but the microphone package structure lacks flexibility in positioning and sound signal reception
Solution Approach 1:
The microphone package structure incorporates dynamic positioning capability by providing multiple solder pad locations (bottom side and lateral side). This allows the package to adapt its mounting orientation dynamically based on the specific application requirements, enabling sound signal reception from different directions while maintaining manufacturing simplicity through consistent fabrication processes
3Adaptability or versatility
If the microphone package structure is designed to receive sound signals from all directions, then it meets diverse user needs, but it requires complex positioning and solder pad arrangements
Solution Approach 1:
The invention adds a lateral dimension to the traditional bottom-only solder pad arrangement by positioning second solder pads on the lateral side of the substrate. This dimensional expansion enables the microphone package to be mounted in different orientations (on its side or flat), achieving multi-directional sound signal reception capability while maintaining relatively simple package structure through straightforward pad placement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the microphone package's versatility in receiving sound signals from all directions, meeting specific user needs while maintaining low manufacturing costs and robust functionality.
Implementation Method 1
a sound wave transducer... is disposed on the top side... converts sound signals from above the microphone package structure or laterally received sound signals into electrical signals
Data Source
AI summary
A microphone package structure includes a substrate, sound wave transducer, processing chip, lid, sound aperture, at least one first solder pad and at least one second solder pad. The substrate has a top side, a bottom side and two opposing lateral sides. The top and bottom sides each connect the lateral sides. The sound wave transducer and processing chip are disposed on the top side. The lid covers the substrate to form a chamber for containing the sound wave transducer and the processing chip electrically connected to the substrate and sound wave transducer. The sound aperture is disposed at the substrate or lid. The at least one first solder pad is disposed on the bottom side and in electrical conduction with the processing chip. The at least one second solder pad is disposed on one of the lateral sides and in electrical conduction with the processing chip.