Integrated Microphone Mesh Configuration for Noise Reduction

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Solution Overview

Problem

Electronic and mechanical noise from internal components within electronic devices interferes with audio capture quality, particularly in devices with limited space constraints, causing unwanted disturbances like crackling, humming, and buzzing.

Innovation Solution

An integrated microphone configuration with a waterproof mesh and cosmetic mesh positioned within a microphone port to absorb mechanical vibrations and reduce electronic noise, utilizing a floating microphone configuration and optimized acoustic transfer impedance to minimize air displacement and noise detection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a screw or bracket is used to secure the microphone to reduce vibrations, then mechanical noise is reduced, but the device consumes excess space in already space-constrained electronic devices

Engineering Contradiction:
Improvemechanical noiseVSAvoidmicrophone system size
Core Design Contradiction:
Object-affected harmful factorsVSVolume of moving object

Solution Approach 1:

The patent introduces a damping material as an intermediary element positioned between the microphone and the PCB. This damping material absorbs mechanical vibrations and reduces noise transmission without requiring additional fastening hardware, thereby maintaining a compact microphone system design while effectively reducing mechanical noise.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces the traditional mechanical fastening system (screws or brackets) with a damping material-based vibration isolation approach. This substitution eliminates the need for additional mechanical components that would increase the microphone system size, while still achieving effective vibration reduction through the damping properties of the material.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Volume of moving object

If the gap around the microphone is reduced by surrounding it with a rigid PCB, then space is optimized, but the microphone vibrates and creates unwanted electronic and mechanical noise

Engineering Contradiction:
Improvemicrophone system sizeVSAvoidnoise
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The damping material serves as an intermediary layer between the rigid PCB and the microphone, decoupling the microphone from the rigid structure. This allows the microphone to be surrounded by the rigid PCB for space optimization while the damping material prevents vibration transmission and noise generation.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The damping material acts as a flexible thin film or layer that conforms to the space constraints imposed by the rigid PCB surrounding, providing vibration isolation without requiring additional space. This flexible approach allows tight integration while maintaining noise reduction performance.

Inventive Principle:
Principle #30Flexible shells and thin films

3Volume of moving object

If electronic components are positioned close to the microphone to optimize device layout, then space is saved, but the microphone detects unwanted electronic noise from components like capacitors and cameras

Engineering Contradiction:
Improvedevice internal spaceVSAvoidelectronic noise
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The damping material serves as a physical intermediary that creates acoustic isolation between the microphone and nearby electronic components. This allows electronic components to be positioned close to the microphone for space optimization while the damping material prevents the transmission of electronic noise and vibrations to the microphone.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively reduces electronic and mechanical noise, enhancing audio capture quality by minimizing interference from internal components, suitable for various electronic devices including smartphones, tablets, and hearing aids.

Implementation Method 1

The waterproof mesh and the cosmetic mesh are positioned in such a manner to reduce an electronic and/or mechanical noise originating from electronic components within the electronic device

Methodology Applied
Scientific EffectVibration absorption: Damping

Implementation Method 2

A waterproof mesh is positioned within the microphone port and defines an interstitial volume between the waterproof mesh and the microphone

Methodology Applied
Scientific EffectAir displacement minimization: Acoustic Absorption

Data Source

PatentUS20250338051A1Integrated Microphone Configuration Directed at Electronic and Mechanical Noise Reduction
Publication Date: 2025.10.30 GOOGLE LLC
  • US20250338051A1 patent drawing
  • US20250338051A1 patent drawing
  • US20250338051A1 patent drawing

AI summary

This document describes an integrated microphone configuration for reducing electronic and mechanical noise in electronic devices. In aspects, a microphone is integrated within a housing of an electronic device that includes a plurality of electronic components. The housing of the electronic device includes a microphone port that defines a cavity extending from an exterior surface to an interior surface of the housing. The microphone port enables acoustic waves to propagate through the cavity to be detected by the microphone. A waterproof mesh is positioned within the microphone port and defines an interstitial volume between the waterproof mesh and the microphone. A cosmetic mesh is also positioned within the microphone port, above the waterproof mesh. The waterproof mesh and the cosmetic mesh are positioned in such a manner to reduce an electronic and/or mechanical noise originating from electronic components within the electronic device.