Microphone Module Fixation Using Adhesive Tape and Conductive Member

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Solution Overview

Problem

Conventional microphone modules in thin electronic devices like laptops face challenges in securing space for screw fixation due to reduced bezel width and ensuring electrical conductivity when using double-sided tapes for adhesion, which compromises air-tightness and grounding.

Innovation Solution

The implementation of a microphone module configuration that includes a flexible substrate, a metallic plate, and a sound hole penetrating through both, with a double-sided tape for adhesion around the sound hole and a conductive member for electrical connection to the chassis, allowing for secure fixation and grounding without the need for screws, even in reduced spaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a screw is used to fix the microphone module to the chassis, then the fixation strength is improved, but the device thickness increases due to the need for screw fastening space

Engineering Contradiction:

Improvefixation strengthVSAvoiddevice thickness

Core Design Contradiction:

StrengthVSLength of moving object

Solution Approach 1:

The patent replaces the mechanical screw fixation system with a double-sided tape adhesive system. The microphone module is fixed to the chassis using double-sided tape, eliminating the need for screw holes and fastening space, thereby reducing device thickness while maintaining fixation capability

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fixation method from mechanical (screw) to chemical/adhesive (double-sided tape). This parameter change in the fixation mechanism allows for thinner device design while still achieving secure attachment of the microphone module to the chassis

Inventive Principle:

Principle #35Parameter changes

2Strength

If a double-sided tape with strong adhesive power is used to fix the microphone module, then the fixation strength is improved, but electrical conductivity for frame ground is lost

Engineering Contradiction:

Improveadhesive strengthVSAvoidelectrical conductivity

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent divides the back surface of the microphone module into two distinct regions: a first region (central area) covered by double-sided tape for adhesive fixation, and a second region (peripheral area) left exposed for electrical grounding. This segmentation allows both strong adhesion and electrical conductivity to be achieved simultaneously

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent applies different properties to different regions of the microphone module back surface. The central region uses insulating double-sided tape for fixation, while the peripheral region maintains metal exposure for conductivity. This local differentiation resolves the contradiction between adhesive strength and electrical grounding

Inventive Principle:

Principle #3Local quality

3Length of moving object

If the bezel width is reduced to make the device thinner, then the device thickness is improved, but the space for screw fastening is lost

Engineering Contradiction:

Improvedevice thicknessVSAvoidfastening space

Core Design Contradiction:

Length of moving objectVSEase of manufacture

Solution Approach 1:

The patent replaces mechanical screw fastening with adhesive double-sided tape fixation. This substitution eliminates the requirement for screw holes and fastening clearance, enabling the use of reduced bezel width and achieving thinner device design without compromising the ability to secure the microphone module

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables the installation of microphones in reduced spaces while ensuring high air-tightness and secure electrical connectivity, eliminating the need for screw mounting and allowing for a more compact design.

Implementation Method 1

a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and configured to fix the microphone module to the chassis

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

a conductive member configured to electrically connect a second region, except the first region, of the metallic plate and the inner surface of the chassis

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS11490185B2Electronic device

Publication Date: 2022.11.01 LENOVO SWITZERLAND INTERNATIONAL GMBH

AI summary

An electronic device includes a chassis, a microphone hole penetrating an outer wall of the chassis, and a microphone module that faces the microphone hole. The microphone module has a microphone that obtains sound information outside the chassis through the microphone hole, a flexible substrate laminated on a back surface of the microphone, a metallic plate laminated on a back surface of the flexible substrate, and a sound hole opened in the back surface of the microphone and penetrating the flexible substrate and the metallic plate. The electronic device further includes a double-sided tape fastened to a first region, surrounding the sound hole, of a back surface of the metallic plate, and to an inner surface of the chassis, and that fixes the microphone module to the chassis, and a conductive member that electrically connects the second region of the metallic plate and the inner surface of the chassis.