Microphone Mounting Structure with Offset Sound Holes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional microphone mounting structures in small devices like cell phones are prone to foreign matter ingress and pop noise due to overlapping sound holes and through-holes, which can damage the diaphragm and compromise sound quality.
Innovation Solution
The microphone is designed with sound receiving sound holes on the circuit board and through-holes on the mounting board positioned perpendicularly and non-overlapping, with external terminals forming an enclosed space to prevent foreign matter entry and reduce pop noise by diffraction of sound waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If the sound hole in the circuit board and the through-hole in the mounting board are superimposed (overlapping configuration), then the microphone can be mounted with reduced space requirements and the parts-mounting surface can face inward, but foreign matter such as dust and water droplets can easily enter the inner space of the microphone and damage the diaphragm
Solution Approach 1:
The patent offsets the sound hole and through-hole positions in the planar dimension, preventing their superposition. By changing the spatial arrangement from overlapping to offset configuration, the patent eliminates the direct pathway for foreign matter while maintaining the compact mounting structure.
Solution Approach 2:
The patent introduces an enclosed space formed by the external terminal as an intermediary barrier between the through-hole and the microphone inner space. This enclosed space acts as a protective mediator that prevents foreign matter from directly reaching the diaphragm while still allowing sound transmission.
2Volume of stationary object
If the sound hole and through-hole are superimposed, then the mounting structure is compact and requires less space, but pop noise occurs because sound waves enter the diaphragm directly through both holes
Solution Approach 1:
The patent changes the spatial arrangement of sound holes and through-holes from overlapping to offset positions in the planar dimension. This dimensional change forces sound waves to travel through the enclosed space with a longer, more complex path, thereby reducing direct sound pressure on the diaphragm and eliminating pop noise.
Solution Approach 2:
The enclosed space formed by the external terminal serves as an acoustic intermediary that modifies sound wave propagation. By introducing this intermediate space, the patent prevents direct sound wave transmission from the through-hole to the diaphragm, thereby reducing pop noise while maintaining compact mounting.
3Volume of stationary object
If foreign matter enters through the superimposed holes during assembly or operation, then the microphone structure remains compact, but the diaphragm can be damaged
Solution Approach 1:
The patent offsets the positions of sound holes and through-holes in the planar dimension to eliminate the direct alignment pathway. This dimensional change creates a physical barrier that prevents foreign matter from traveling directly from the through-hole to the diaphragm, thereby protecting the diaphragm while maintaining compact mounting.
Solution Approach 2:
The enclosed space formed by the external terminal acts as a protective intermediary barrier. This intermediary space physically blocks foreign matter from reaching the diaphragm while still allowing acoustic energy to pass through, thereby enhancing diaphragm protection without compromising the compact structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents foreign matter from entering the microphone, protects the diaphragm, and reduces pop noise by ensuring sound waves are diffracted before reaching the diaphragm, thus enhancing sound quality and reliability in compact devices.
Implementation Method 1
reduces pop noise by ensuring sound waves are diffracted before reaching the diaphragm
Data Source
AI summary
A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.