Microphone Package Multi-Surface Electrode Pads Mounting
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Solution Overview
Problem
Conventional microphone packages face limitations in mounting flexibility and compactness, particularly in small electronic devices like wearable devices, as they can only be mounted in one direction, either parallel or perpendicular to the main board, which restricts their application due to increased footprint or the need for additional sockets.
Innovation Solution
A microphone package design featuring a substrate with acoustic and via holes, a directional acoustic sensor, and multiple electrode pads on different surfaces, allowing for flexible mounting in either direction parallel or perpendicular to the main board, along with a cap and sensor control chip for enhanced functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional microphone package is designed with fixed mounting orientation, then the structure is simple, but the adaptability to different electronic devices is limited
Solution Approach 1:
The microphone package is designed with electrode pads distributed on multiple surfaces (front surface, rear surface, and side surfaces) of the substrate, enabling the package to be mounted in multiple orientations (parallel or perpendicular to the main board) without requiring different package designs. This multi-functional electrode pad arrangement allows a single package structure to serve universal mounting requirements across different electronic devices.
Solution Approach 2:
The invention transitions from traditional two-dimensional electrode pad arrangement (only on front or rear surface) to three-dimensional distribution by placing electrode pads on the side surfaces of the substrate. This dimensional expansion enables flexible mounting orientations by providing electrical connection points in multiple spatial directions, resolving the contradiction between mounting flexibility and structural simplicity.
2Area of stationary object
If a microphone package is mounted perpendicular to the main board, then the footprint area is reduced, but additional sockets are required increasing device complexity
Solution Approach 1:
The microphone package incorporates electrode pads on all relevant surfaces (front, rear, and side), making it universally adaptable to both parallel and perpendicular mounting orientations. When mounted perpendicular to the main board, the side surface electrode pads can directly contact the main board, eliminating the need for additional sockets and reducing device complexity while maintaining reduced footprint area.
3Ease of operation
If a microphone package is mounted parallel to the main board, then the mounting process is simple, but the footprint area increases
Solution Approach 1:
By distributing electrode pads on side surfaces in addition to front and rear surfaces, the invention enables the package to utilize vertical space more effectively. When mounted parallel to the main board, the extended side surface pads allow for optimized trace routing that can reduce the required footprint area while maintaining simple mounting process characteristics.
Data Source
AI summary
A microphone package and an electronic apparatus including the same are provided. The microphone package includes a substrate in which an acoustic hole and a via hole are formed; an acoustic sensor attached to a front surface of the substrate and covering the acoustic hole; a first electrode pad provided on the front surface of the substrate; a second electrode pad provided on a rear surface of the substrate and electrically connected to the first electrode pad through the via hole; and a third electrode pad on a side surface of the substrate and electrically connected to the second electrode pad.